The heterogeneous nucleation of primary Si and eutectic Si can be attributed to the presence of AlP. Although P, in the form of AlP particles, is usually observed in the centre of primary Si, there is still a lack of detailed investigations on the distribution of P within primary Si and eutectic Si in hypereutectic Al-Si alloys at the atomic scale. Here, we report an atomic-scale experimental i...

Eutectic solvent can solubilize high amount of some therapeutic compounds. Volatile eutectic solvent is interesting to be used as solvent in the preparation of nanosuspension with emulsion solvent evaporation technique. The mechanism of transformation from the eutectic emulsion to nanosuspension was investigated in this study. The 30% w/w ibuprofen eutectic solution was used as the internal pha...

CMOS compatible metallic hermetic sealing using Al-Ge eutectic alloy for packaging MEMS devices for harsh environments has been developed. The effects of various bonding parameters on the bond quality have been extensively reported. The reliability of this eutectic joint subjected to high operating temperatures involved in deep oil well logging application has been investigated with the specifi...

Controlling the growth of eutectic Si and thereby modifying the eutectic Si from flake-like to fibrous is a key factor in improving the properties of Al-Si alloys. To date, it is generally accepted that the impurity-induced twinning (IIT) mechanism and the twin plane re-entrant edge (TPRE) mechanism as well as poisoning of the TPRE mechanism are valid under certain conditions. However, IIT, TPR...

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 C, ...

The effects of a third element, namely silver, copper, zinc, or antimony, on the microstructure and mechanical properties of eutectic tin-bismuth (Sn–Bi) solder were investigated. The investigation showed that, except for zinc, the addition of a trace amount of the third element improves the ductility of the Sn–Bi solder owing to the formation of a fine, homogeneous ternary eutectic microstruct...

The microstructures of eutectics between compounds were studied for systems MnO-MnS, NaCl-NaF, NaBr-NaF, LiF-NaF, and FeO-FeS. With the exception of FeS, all the compounds had the NaC1-type structure. In the systems having only NaC1-type structures, the lamellas of the two eutectic phases had matching crystal orientations. There was less consistency among the eutectic systems, however, than bet...

Extending previous work [Pusztai et al., Phys. Rev. E 87, 032401 (2013)], we have studied the formation of eutectic dendrites in a model ternary system within the framework of the phase-field theory. We have mapped out the domain in which two-phase dendritic structures grow. With increasing pulling velocity, the following sequence of growth morphologies is observed: flat front lamellae → eutect...