A method for measuring the real-time corrosion rates for Alloy 718, stainless steels (SS) 304L and 316L nuclear grade (NG), aluminum alloys 5052 (Al5052) and 6061 (Al6061), copper (Cu), tantalum (Ta), and tungsten (W) in two separate water systems that were irradiated by 800 MeV protons is presented. The ®rst water system was fabricated entirely of 304 SS, thoroughly cleaned before operation, a...

Title of Dissertation: CREEP CORROSION OVER PLASTIC ENCAPSULATED MICROCIRCUIT PACKAGES WITH NOBLE METAL PREPLATED LEADFRAMES Ping Zhao, Doctor of Philosophy, 2005 Dissertation Directed By: Dr. Michael Pecht, Professor, Department of Mechanical Engineering Field failures were observed to be caused by the bridging of corrosion products across lead fingers. This phenomenon was identified as creep ...

In this research accumulative roll bonding process as sever plastic deformation process was applied up to 8 cycles to produce the ultrafine grain copper. Microstructure of cycle 1, cycle 4 and cycle 8 investigated by TEM images. By analyzing TEM images the grain size measured below 100 nm in cycle 8 and it was with an average grain size of 200 nm. Corrosion resistance of rolled copper stri...

We report the use of atomically thin layers of graphene as a protective coating that inhibits corrosion of underlying metals. Here, we employ electrochemical methods to study the corrosion inhibition of copper and nickel by either growing graphene on these metals, or by mechanically transferring multilayer graphene onto them. Cyclic voltammetry measurements reveal that the graphene coating effe...

The corrosion resistant coatings used conventionally are susceptible to degradation, leading to pitting corrosion. This report summarizes the corrosion resistant nature of thin films of Cu-TiO2 coated on mild steel, in different corrosion environments. Nano meter thick (100nm, 125nm, 150nm) composite coatings were coated on steel substrate by RF magnetron sputtering technique. The required targ...

The effect of Cu on the localized corrosion of Ni-Cr-Mo alloys has been investigated in hot saline solutions by comparing the behavior of N06059 and N06200 alloys, using electrochemical and surface analytical techniques. No measurable effect of copper on anodic film growth kinetics and passive film properties was detected and the breakdown and repassivation potentials of the alloys were very si...

Sulfur dioxide (SO2), a typical gaseous compound found in the atmosphere, corrodes metals, particularly outdoors. When SO2 adsorbs on the surface electrolyte, it easily dissolves, resulting in the formation of protons (H+) and bisulfite ions (HSO3). The former reduces the pH of the surface electrolyte, which promotes metal dissolution. Silver and copper are commonly used in the electronic compo...

This thesis presents a new experimental setup for surface analysis studies, incorporating chemical information from infrared reflection absorption spectroscopy (IRAS) and quantitative information from quartz crystal microbalance (QCM). The integrated IRAS/QCM surface analysis system enables in situ studies to be conducted of the metal/atmosphere interaction on a sub-monolayer level. In combinat...

Test printed circuit test boards (PCBs) with various surface finishes were subjected to a mixed flowing gas environment with gaseous composition adjusted to achieve a targeted 500600 nm/day copper corrosion rate. Board surface finishes included immersion silver (ImAg), organic solderability preservative (OSP) and lead-free hot-air-solder leveling (Pbfree HASL). The PCB test specimens were prepa...

Immersion tin is widely used as lead free surface finish in the printed circuit board technology. Tin prevents the underlying copper from corrosion and preserves its solderability during a long storage and lead-free assembly processes. In the paper immersion tin coatings of different thickness (0.2 ÷ 1.5 μm) deposited on copper foil from methanelulphonic bath were investigated. The layers were ...