Insulation co-ordination and the risk of failure for insulation can be predicted if critical flashover (CFO) and insulation withstand voltages are known. The paper aims at using the statistical method of evaluating the critical flashover and the withstand voltage for an airgap distance of 10cm. The work was carried out with a point-plane electrode (needle point) arrangement using air as the die...

We present experimental results on single-event-induced breakdown in sub-5-nm plasma-enhanced SiO2, nitrided SiO2, Al2O3, HfO2, and Zr0 4Si1 6O4 dielectrics typical of current and future-generation commercial gate oxides. These advanced oxides are found to be quite resistant to ion-induced breakdown. Radiation-induced soft breakdown was observed in some films with 342 MeV Au (LET = 80 MeV/mg/cm...

In this paper, we report a two-dimensional (2D) simulation for InGaAs/InAlAs separate absorption, grading, charge, and multiplication avalanche photodiodes (SAGCM APDs) and study the effect of the charge layer and multiplication layer on the operating voltage ranges of APD. We find that with the increase of the thicknesses as well as the doping concentrations of the charge layer and the multipl...

The application of Super Junction concepts to a low voltage power MOSFET is investigated. The body junction is modified with the addition of a high energy implant, resulting in an increased breakdown voltage. Simulations are used to quantify the relationship between dose and breakdown voltage, resulting in a predicted 35% Rds(on) reduction. This is confirmed through experiment, and a 19% reduct...

A new output structure for class E power amplifier (PA) is proposed in this paper. A series LC resonator circuit, tuned near the second harmonic of the operating frequency is added to the output circuit. This resonator causes low impedance at the second harmonic. The output circuit is designed to shape the switch voltage of the class E amplifier and lower the voltage stress of the transistor. T...

Smart power ICs, which monolithically integrate low-loss power devices and control circuitry, have attracted much attention in a wide variety of applications [1], [2]. Commonly used smart power devices are the LDMOS and LIGBT implemented in bulk silicon or SOI (Silicon on Insulator). One of the key issues in the realization of such ‘smart power’ technology is the isolation of power devices and ...