A novel approach of chemical mechanical polishing (CMP) is developed for cadmium zinc telluride (CdZnTe or CZT) wafers. The approach uses environment-friendly slurry that consists of mainly silica, hydrogen peroxide, and citric acid. This is different from the previously reported slurries that are usually composed of strong acid, alkali, and bromine methanol, and are detrimental to the environm...

the present paper describes the designing of a thermally and economically optimum mechanical draft counter-flow wet cooling tower. the design model allows the use of a variety of packing materials in the cooling tower toward optimizing heat transfer. once the optimum packing type is chosen, a compact cooling tower with low fan power consumption is modelled within the known design variables. mor...

BACKGROUND Tricuspid regurgitation (TR) is regarded as a secondary disorder. Aim of the study was to know what percentage is secondary to heart and lung disease and its prevalence in normal adults. METHODS Two hundred and 30 adults with clinically detectable TR were studied clinically to know the cause of TR. RESULTS Thirteen percent of the adults were normal without any detectable cause fo...

a thermodynamic analysis of the counter flow wet cooling tower (cwct) in the steelmaking unit of the khuzestan steel company (ksc) is performed in this paper. we evaluated both energy and exergy formulations for analyzing the heat and mass transfer, exergy and second-law efficiency in this cooling tower. the lewis factor le f is an indication of the relative rates of heat and mass transfer in a...

We present a new model for dishing and erosion during chemical-mechanical planarization. According to this model, dishing and erosion is controlled by the local pressure distribution between features on the wafer and the polishing pad. The model uses a contact mechanics analysis based on the work by Greenwood to evaluate the pressure distribution taking into account the compliance of the pad as...

CMP is a planarization technique for multilevel VLSI metallization processes. CMP fills are inserted as a design for manufacturability (DFM) methodology to improve pattern-dependent post-CMP topography, i.e., to improve interconnect planarity. Design-driven fill synthesis seeks to optimize CMP fill with respect to objectives beyond mere density uniformity. Design-driven fill synthesis minimizes...

Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles. With the increasing integration of semiconductor devices, CMP gaining importance in manufacturing. Abrasive-free (AF-CMP) uses solutions do not contain particles to reduce scratches improve capabilities. However, because AF-CMP does use for re...