The printing conditions in Fused Deposition Modelling (FDM) affect the amount of induced residual stresses within printed part and its dimensional accuracy. Among thermoplastic feedstock for FDM, semi-crystalline polymers are more prone to distortion due crystallisation. Therefore, this study aims numerically investigate behaviour polymer under various FDM (namely print speed ambient temperatur...

Warpage and shrinkage control are important factors in proving the quality of thin-wall parts in injection modeling process. In the present paper, grey relational analysis was used in order to optimize these two parameters in manufacturing plastic bush of articulated garden tractor. The material used in the plastic bush is Derlin 500. The input parameters in the process were selected according ...

1 According to general relativity theory, compact concentrations of energy (e.g., neutron stars and black holes) should warp spacetime strongly, and whenever such an energy concentration changes shape, it should create a dynamically changing spacetime warpage that propagates out through the Universe at the speed of light. This propagating warpage is called gravitational radiation—a name that ar...

Process analysis and simulations on molding experiments of 3D thin shell parts have been conducted. Moldings were carried out with polyoxymethylene (POM). The moldings were performed with cavity pressure sensors in order to compare experimental process results with simulations. The warpage was characterized by measuring distances using a tactile coordinate measuring machine (CMM). Molding simul...

Thermally induced stresses play a very important role in controlling the structural reliability of microchip packages. In order to evaluate the magnitude of the warpage of measured objects caused by such stresses, the shadow moiré technique was suggested, where how the moiré fringes are extracted is the key feature. In this work, an improved filtering algorithm based on a nonlinear diffusion eq...

This paper demonstrates how the use of product analysis combined with process data can provide information about the product quality impact of high-level process decisions. A specific case study involving the warpage of two PWB designs as they move through a reflow oven is presented. A new approximate thermal model is derived which analyzes processing rate dependent warpage, an important metric...

The thermomechanical warpage or vertical deflection of microelectronic packages due to temperature change is caused by the mismatch in the coefficients of thermal expansion between vertically asymmetric layers of materials. The structure of many microelectronic packages may be characterized as a multi-layered plate consisting of two regions, that of a die area and a mold area. Physical observat...

The addition of polymer dielectric films to silicon wafers is useful in producing stress reduction layers and interconnect structures for chip-scale packaging as well as 3D wafer stacks. The use of lower cure temperature materials offers several advantages including a lowered thermal budget on devices that are sensitive to electrical performance change with temperature. Unfortunately, enough st...

In recent years, the future trend of micro HDD driver IC for large capacity micro HDD is to become lighter, thinner, shorter and smaller. Among all the options available for micro HDD driver IC’s assembly, warpage is an important issue related to micro HDD driver IC manufacturability and reliability. The optimal packaging manufacturing process for driver IC for micro HDD is chip scale package (...

Package technology is constantly improving in order to keep up with the advances in silicon technology. Multi layered packages exhibit several failure modes that can be predicted using modern software tools. This paper provides a methodology for creating a high-fidelity model of the interposer with all the conductor geometries. The two failure modes that are explored with this model are package...