After many years as a hypothetical possibility, 3D integrated circuits (3D IC) stacking has emerged as a potential key enabler for maintaining semiconductor performance trends. Implementing 3D, however, will almost certainly require development of through-silicon vias (TSVs), which in the past few years have been elevated by the semiconductor industry to the status of a crucial mainstream techn...

This article presents key research needs in three-dimensional integrated circuit (3D IC) architectural floorplanning. Architectural floorplaning is done at a very early stage of 3D IC design process, where the goal is to quickly evaluate architectural designs described in register-transfer level (RTL) in terms of power, performance, and reliability. This evaluation is then fed back to architect...

We demonstrate the use of coherent anti-Stokes Raman scattering (CARS) microscopy to image brain structure and pathology ex vivo. Although non-invasive clinical brain imaging with CT, MRI and PET has transformed the diagnosis of neurologic disease, definitive pre-operative distinction of neoplastic and benign pathologies remains elusive. Definitive diagnosis still requires brain biopsy in a sig...

In Dynamical Systems, Birkho gave a clear formulation of a cross section, suggested a possible generalization to cross sections with boundary, and raised the question of whether or not such cross sections exist in the three-body problem. In this work, we explicitly develop Birkho 's notion of a generalized cross section, formulate homological necessary conditions for the existence of a cross se...