An approximate analytical model is developed for predicting the thermal contact resistance of spherical rough solids with the presence of interstitial gases. The joint resistance includes four thermal resistances, that is, macrogap, microgap, macrocontact, and microcontacts. Simple relationships are derived for each component of the joint resistance assuming contacting surfaces are of uniform t...

Thermal contact constriction between a chip and a heat sink assembly of a microelectronic application is investigated in order to access the thermal performance. The finite element model (FEM) of the electronic device developed using ANSYS software was analysed while the micro-contact and micro-gap thermal resistances were numerically analysed by the use of MATLAB. In addition, the effects of f...

The melting duration and molten depth are key information for Laser-Assisted Direct Imprinting, which raises the issue of the melting & solidification induced by excimer-pulse-laser shining through unilaterally transparent binary materials. Based on the matured laser-annealing analysis, the thermal-contact resistance is taken into account to simulate and predict the melting behavior for this pr...

thermal contact conductance (tcc) between an exhaust valve and its seat is one of the important parameters to be estimated in an internal combustion engine. an experimental study presented here to acquire temperature in some interior points to be used as inputs to an inverse analysis. an actual exhaust valve and its seat are utilized in a designed and constructed setup. conjugate gradient metho...

In this work the effect of different bonding temperatures on the thermal stability of anisotropic conductive films (ACFs) was investigated. A thermogravimetric analyzer (TGA) was utilized to determine the thermal decomposition temperature of ACF. The experimental results showed that the temperature for maximum decomposition rate of ACF, Tm decreased with increasing bonding temperature. The resu...

Accurate information on heat transfer and temperature distribution in metal foams is necessary for design and modeling of thermal-hydraulic systems incorporating metal foams. The analysis of this process requires determination of the effective thermal conductivity as well as the thermal contact resistance (TCR) associated with the interface between the metal foams and adjacent surfaces/layers. ...

A compact analytical model is developed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The joint resistance includes two components: i) bulk resistance of the polymer and ii) micro, constriction/spreading resistance of the microcontacts at the interface. Performing a deformation analysis, it is shown that the deformation mode of the polymer asperities is ...

Due to rapidly increasing power densities in nanoelectronics, efficient heat removal has become one of the most critical issues in thermal management and nanocircuit design. In this study, we report a surface nanoengineering design that can reduce the interfacial thermal resistance between graphene and copper substrate by 17%. Contrary to the conventional view that a rough surface tends to give...

Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic force microscopy tips were performed to determine the contact resistance between an organic thin film and Si. The measurement methodology presented demonstrates how the thermal contrast signal obtained during a force-displacement ramp is used to quantify the resistance to heat transfer through an i...