The coupling effect of interfacial reactions between two pads in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints was investigated in this paper. After reflow soldering, a large amount of Cu can diffuse across the solder joint to the opposite pad to form (Cu,Ni)6Sn5 IMC on the Ni pad in Ni-SnAg-Cu solder joint. A little Ni can also be detected in Cu6Sn5 layer, which contains some trapped solder, o...

The authors present a sensor for real-time detection of solder-joint faults in programmed, operational Field Programmable Gate Arrays (FPGAs), especially those FPGAs in Ball Grid Array (BGA) packages, such as a XILINX® FG1156 [1]. FPGAs are used in all manner and kinds of control systems in aerospace applications. The ability to sense high-resistance faults in the solder joints of operational F...

This paper describes the design and construction of an open automated solder bond veri cation machine for the electronics manufacturing industry The application domain is the higher end assembly technologies with an emphasis on ne pitch surface mount components The system serves a measurement function quantifying the solder bonds It interfaces with the manufacturing process to close the manufac...

The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers' high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the constructio...

Title of Document: AN ANALYTICAL MODEL FOR DEVELOPING A CANARY DEVICE TO PREDICT SOLDER JOINT FATIGUE FAILURE UNDER THERMAL CYCLING CONDITIONS Sony Mathew, Ph.D., 2015 Directed By: Professor Michael G. Pecht , Department of Mechanical Engineering Solder joint fatigue failure is a prevalent failure mechanism for electronics subjected to thermal cycling loads. The failure is attributed to the the...

Title of dissertation: FLEX CRACKING AND TEMPERATUREHUMIDITY-BIAS EFFECTS ON RELIABILITY OF MULTILAYER CERAMIC CAPACITORS Mohammadreza Keimasi, Doctor of Philosophy, 2007 Dissertation directed by: Professor Michael Pecht Department of Mechanical Engineering Multilayer ceramic capacitors (MLCCs) are known to be susceptible to cracking when subjected to excessive printed circuit board (PCB) flexu...

0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.06.013 * Corresponding author. Tel.: +852 2788 7130; fax: E-mail address: [email protected] (Y.C. Chan Nano-sized, nonreacting, noncoarsening Al2O3 particles have been incorporated into eutectic Sn–Zn solder alloys to investigate the microstructure, hardness and shear strength on Au/Ni metallized Cu pads ball grid...

Title of Dissertation: EFFECT OF DYNAMIC FLEXURAL LOADING ON THE DURABILITY AND FAILURE SITE OF SOLDER INTECONNECTS IN PRINTED WIRING ASSEMBLIES Joseph Varghese, Doctor of Philosophy, 2007 Dissertation directed by: Professor Abhijit Dasgupta Department of Mechanical Engineering This dissertation investigates the durability of solder interconnects of area array packages mounted on Printed Wiring...

The underfilling BGA as an alternative to direct chip attachment for high density packaging technologies have been developed. This paper discusses the thermomechanical and metallurgical effects of underfill material and the resulting improvement in board level reliability for underfilled BGA assemblies. Finite element analysis (FEA) models were developed to predict the thermal fatigue life of t...

Leaded solder ball was replaced by leadfree solder ball which is now widely used in semiconductor industries, due to the hazardous effects of lead to human’s health and toxicity for environment. Due to this, poor solder joint strength for Ball Grid Array (BGA) packages on leadfree devices is a reliability concern when subjected to reliability stress test. With a polymer core in the solder ball ...