Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, a user-friendly automatic polishing system was developed in this research. The polishing system is composed of two subsystems, a three-axis machining center and a two-axis...

This paper presents the results of five years monitoring of an experimental wastewater treatment plant in southeast Brazil, comprised of a UASB reactor followed by a submerged aerated biofilter (BF) (field scale) and shallow polishing ponds (pilot scale). Three ponds in series achieved high quality effluent standards in terms of ammonia and E.coli, but a fourth pond did not result in further ef...

Quantitative studies of the optical parameters surface layer formed during polishing quartz glass have been carried out. It is shown that mechanism formation when using methods mechanochemical and ion has much in common. In both cases, appearance a layer, which differs by high refractive index from corresponding bulk properties glass, associated with stress breaking Si-O-Si bridge bonds hydroly...

Recently, the magnetorheological (MR) polishing process has been examined asa new ultra-precision polishing technology for micro parts in MEMS applications. In theMR polishing process, the magnetic force plays a dominant role. This method uses MRfluids which contains micro abrasives as a polishing media. The objective of the presentresearch is to shed light onto the material removal mechanism u...

In the Chemical Mechanical Polishing (CMP) process used for microelectronics manufacturing, three contact regimes between the wafer surface and the polishing pad may be proposed: direct contact, mixed or partial contact, and hydroplaning. An effective in-situ method for characterizing the wafer/pad contact and a systematic way of relating contact conditions to the process parameters are both la...

This study discusses the improvement of surface finish of medium or large holes beyond traditional drilling, boring, rough turning, or extruding by electrochemical smoothing using inserted rib-plate electrodes. High electrical current is not required when the rib plate is used to reduce the engaged area for large hole. Traditionally, the hole polishing requires a sequence of complicated premach...

As device sizes are scaled to sub-micron dimensions, planarization technology becomes increasingly important, both for bipolar and CMOS trench isolation and for multi-level interconnects and wiring. Although chemi-mechanical polishing (CMP) has been used extensively in silicon technology for wafer preparation[l,2], it is only recently that CMP has emerged as a new technique for achieving a high...

In order to obtain well-proportioned surface quality and high polishing efficiency of free-form mould, a robotic gasbag polishing technique using an improved spinning-inflated-gasbag polishing tool is proposed in this paper. The improved polishing tool consists of three detachable modules, which are the drive, soft rubber gasbag and magnetorheology. The six degrees of freedom industrial robot w...

Following the controversy between two previous publications (Lorenzo et al 2008 Phys. Rev. Lett. 101 226401 and Garcia et al 2009 Phys. Rev. Lett. 102 176405), we report on the influence of mechanical polishing, and subsequent sample storage, on the electronic order at the Verwey transition of highly pure magnetite, Fe(3)O(4), by resonant x-ray scattering. Contrary to expectations, mechanical...

The aim of this study was to determine surface roughness and topography of polished dental resin-based nanocomposites. Four representative dental resin-based nanocomposites were tested in the study: two nanohybrids (Filtek Z550 and Tetric EvoCeram) and two nanofilled (Filtek Ultimate Body and Filtek Ultimate Translucent); and two reference materials: one microfilled (Gradia Direct) and one micr...