نتایج جستجو برای: pin geometry

تعداد نتایج: 157791  

2001
Lior Wolf Amnon Shashua

Projection matrices from projective spaces P to P have long been used in multiple-view geometry to model the perspective projection created by the pin-hole camera. In this work we introduce higher-dimensional mappings P ! P, k = 4; 5; 6 for the representation of various applications in which the world we view is no longer rigid. We also describe the multi-view constraints from these new project...

Journal: :Analytical sciences : the international journal of the Japan Society for Analytical Chemistry 2005
Hideshi Ishii Jun Kawai

X-ray absorption spectral (XAS) analysis is performed with a combination of a 9 V dry electric battery X-ray generator and a portable Si PIN X-ray detector. The calcium K edge (4.0 keV) in paper is measured with a grazing incidence geometry, which suppressed the artifact due to the Kalpha X-ray fluorescence peak at 3.5 keV. The 9 V dry battery X-ray emitter is useful for portable XAS measurements.

2010
Bo Cornelissen Remko Akkerman

Fibrous tows used in continuous fibre-reinforced polymers (CFRPs) deform geometrically during the production of composite products. The cross-sectional geometry of the tow is influenced by the load-induced deformation mechanisms. A study of the effect of two commonly assumed geometrical tow shapes on an equivalent pressure distribution in a tow-on-a-pin spreading arrangement was performed. The ...

Journal: :Microelectronics Reliability 2012
Patrik Pribytny Daniel Donoval Ales Chvála Juraj Marek Marian Molnar

Numerical modelling and simulation provide an efficient tool for analysis and optimization of device structure design. In this paper we present the analysis and the geometry optimization of the power module with high power pin diode structure supported by the advanced 2-D/3-D mixed-mode electro-thermal device simulation. The structure under investigation is P + NN + power diode device designed ...

2015
Hsin-Ting Jonathan Liu

A cam driving a lumped inertia through a massless, elastic, slider-crank fol­ lower linkage with two concentrated masses located at the pin joints is considered. An iterative procedure taking the elasticity, damping, and changing geometry of the linkage into account is developed for synthesizing the cam profile to produce a desired output motion at a given design speed. The steady state solutio...

2008
Jean-Yves Welschinger

Following the approach of Gromov and Witten [3, 20], we define invariants under deformation of stongly semipositive real symplectic manifolds provided essentially that their real locus is Pin. These invariants provide lower bounds in real enumerative geometry, namely for the number of real rational J-holomorphic curves which realize a given homology class and pass through a given real configura...

ژورنال: محاسبات نرم 2017

One of the stages of quality control in porcelain producing factories is sorting that do with human eyes. Machine vision , including new methods for defect  detection and sorting of different products. In this study, with defects diagnosis and as a result sorting porcelain, use from linear structured light pattern, triangulation techniques and rules governing mirrors. Also, among the defec...

2003
Paolo Favaro Stefano Soatto

We present a novel algorithm to reconstruct the geometry and photometry of a scene with occlusions from a collection of defocused images. The presence of a finite lens aperture allows us to recover portions of the scene that would be occluded in a pin-hole projection, thus “uncovering” the occlusion. We estimate the shape of each object (a surface, including the occluding boundaries), and its r...

2010
J.-G. Gong Y.-C. Jiao Q. Li J. Wang G. Zhao

A miniaturized internal wideband antenna suitable for integration with the printed circuit board (PCB) of a wireless universal serial bus (WUSB) dongle is presented in this paper. The proposed antenna mainly consists of a folded metal plate with two sides beveled. By introducing a short-circuited pin connected to the system ground and etching a pair of slots in the bevel sides of the folded met...

1999
L. Nguyen N. Kelkar T. Kao A. Prabhu

This paper will discuss the solder joint reliability aspects of a new wafer level Chip Scale Package (CSP) form factor. The CSP requires no leadframe or interposer tooling. It is the same size as the die, and was originally developed for low-pin count analog devices for pitches from 0.8 mm down to 0.5 mm. The package has been demonstrated with eutectic solder bumps on 8-lead devices. The form f...

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