We present a modification of the interferometric method for the measurement of optical fiber chromatic dispersion using an easily aligned, almost all-fiber Michelson interferometer. Particular issues of the microstructure fiber characterization are discussed. Accuracy of the method is validated by comparing the chromatic dispersion measurement of the standard single-mode fiber with results obta...

The cervix softens and shortens as its collagen microstructure rearranges in preparation for birth, but premature change may lead to premature birth. The global preterm birth rate has not decreased despite decades of research, likely because cervical microstructure is poorly understood. Our group has developed a multilevel approach to evaluating the human cervix. We are developing quantitative ...

We have developed a generalized Bloch wave approach for the analysis of aperiodic gratings. This method yields both a macroscopic (i.e., reflection or transmission coefficient) as well as a microscopic (i.e., dispersion diagram and microstructure of the propagating internal field) characterization of fiber and waveguide aperiodic gratings.

The main objective of the present work is to processing the porous Si-SiC ceramic by the oxidation of C/C-SiC composite. Phase studies are performed on the oxidized porous composite to examine the changes due to the high temperature oxidation. Further, various characterization techniques are performed on Si-SiC ceramic in order to study the material’s microstructure.

Earth-abundant sustainable inorganic thin-film solar cells, independent of precious elements, pivot on a marginal material phase space targeting specific compounds. Advanced materials characterization efforts are necessary to expose the roles of microstructure, chemistry, and interfaces. Herein, the earth-abundant solar cell device, Cu2ZnSnS(4-x)Se x , is reported, which shows a high abundance ...

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...