نتایج جستجو برای: laser soldering
تعداد نتایج: 185997 فیلتر نتایج به سال:
In the electronics manufacturing industry, soldering plays a key role in the process, whether it is carried out manually, semi-automatically or fully automatically. Even though the basic techniques in manual soldering are comparatively straightforward, to master it at a high level still requires a lot of time and effort. The research presented in this paper aims to identify the motor skills inv...
Over recent years the electronics manufacturing industry has seen a shift away from wave soldering towards reflow soldering [1]. However, although wave soldering is indeed mature (first used during the 1950’s [eg 2]), there is still significant activity with novel process development to match [3]. This paper concerns a new type of noclean liquid flux for wave soldering that is based on water [4...
The long-term effects of orthodontic appliances in the oral environment and the subsequent leaching of metals are relatively unknown. A method for determining the effects of various types of soldering and welding, both of which in turn could lead to leaching of metal ions, on the growth of osteoblasts, fibroblasts, and oral keratinocytes in vitro, is proposed. The effects of cell behaviour of m...
Today’s wave soldering processes solder electronic assemblies within the large eutectic tin lead processing window. The issues surrounding the conversion to lead free assembly are multiple and varied. Logistics, cost, material selection, and equipment choices/options are some of these challenges that require planning and organization. However, at the core of lead free assembly is soldering. The...
What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...
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