Only a few devices are not yet compatible with SMT principles: a few "exotic" components like large capacitors, resistors, inductors, varistors, etc. and almost all the power semiconductor packages. Several drawbacks are associated with existing power packages: by P. Casati & C. Cognetti A New High Power IC Surface Mount Package Family: PowerSO-20TM & PowerSO-36 Power IC Packaging from Insertio...

In the fast-paced semiconductor industry, time to market means everything. Accommodating the shortened design cycles, however, is hampered by the ever-increasing design complexity. In addition, the continual drive to achieve higher performance (speed, area, power) has fueled the introduction of new manufacturing processes. Existing integrated circuit design methodologies, such as standard-cells...

An EEG acquisition system using 0.18μm technology is proposed. EEG input signals are of the range of few micro-voltage. Hence a high gain operational transconductance amplifier with gain of 62.45dB is designed for the acquisition system. The proposed amplifier and multiplexer have been tested for the EEG signals and their performance is reported at operating voltage of 1.8 volts. This design ca...

This paper presents two highly integrated receiver circuits fabricated in InP heterojunction bipolar transistor (HBT) technology operating at up to 2.5 and 7.5 Gb/s, respectively. The first IC is a generic digital receiver circuit with CMOS-compatible outputs. It integrates monolithically an automatic-gain-control amplifier, a digital clock and data recovery circuit, and a 1 : 8 demultiplexer, ...

Performance studies, linking ATM switch capabilities to physical limitations imposed by integrated circuit technology, have been scarce. This paper explores trends in circuit capabilities, and makes projections toward the 0.25m technologies that will be available to all switch designers in the year 2000. The limits imposed by circuit technology are applied to shared buffer ATM switches. We dete...

As CMOS scaling options are exhausted by fundamental limitations, device and circuit integration in the third-dimension could provide a possible pathway without extensively relying on ultra-scaled transistors. So far, however, the migration of CMOS to 3-D has been unattainable. The CMOS fabric architecture uses complementary MOSFETs in an inverted logic, where both pull-up and pull-down transis...

This work presents a Neuro-Fuzzy network implemented in 0.8μm CMOS analog technology. The architecture and the circuit configurations adopted are discussed. The circuit has been designed taking into account mismatch effects and Spectre simulations have been reported. An integrated circuit has been realized and is now under test. Key-Words: Neuro-Fuzzy, Analog, Mixed Signal, VLSI, Embedded Appli...

Progress of integrated circuit technology allows integration of analog and digital circuits on the same chip. This co-integration yields higher performances and reliability, while reducing power consumption, but also raises new challenges for circuit designers. The substrate noise generated by the switching digital part has detrimental effects on the analog part. In this contribution, a wide-ba...