نتایج جستجو برای: electroplating

تعداد نتایج: 2876  

Journal: :Jitsumu Hyomen Gijutsu 1986

Journal: :iranian journal of chemistry and chemical engineering (ijcce) 2015
hongbo xu dan-dan liu lu he na liu guiling ning

the poly(ethyleneimine)-functionalized silica has been developed successfully as an effective adsorbent for the adsorption removal of cu(ii) ions from electroplating wastewater. the influences of ph, contact time and initial concentration of cu(ii) ions on the adsorption capacity and the effect of adsorbent dosage on the removal efficiency of cu(ii) ions from electroplating wastewater were inve...

2003
Joseph Kennady R. M. Krishnan

he wide use of nickel coatings is T due to their valuable properties.l-2 Nickel coatings are used primarily for decorative and industrial purposes. The uses of nickel in the decorative field are. numerous including automobile parts, fumiture, general hardware and fasteners, bicycles, as undercoats in low-cost jewelry, sporting equipment, toys, cutlery, lamps and plumbing fixtures. Most of the d...

Dan-dan Liu Guiling Ning Hongbo Xu, Lu He Na Liu

The poly(ethyleneimine)-functionalized silica has been developed successfully as an effective adsorbent for the adsorption removal of Cu(II) ions from electroplating wastewater. The influences of pH, contact time and initial concentration of Cu(II) ions on the adsorption capacity and the effect of adsorbent dosage on the removal efficiency of Cu(II) ions from electroplatin...

Journal: :Journal of nanoscience and nanotechnology 2011
Xiaohui Lin Xinyuan Dou Xiaolong Wang Ray T Chen

We demonstrated a practical process of fabricating nickel molds for nanoimprinting. Dual-side polished glass is chosen as the substrate on which nickel nanostructures are successfully electroplated. Photonic crystal structures with 242 nm diameters and other nanoscale pillars down to 9 nm diameters are achieved over a large area. The electroplating parameters are investigated and optimized. Thi...

2014
Ching An Huang Yu Hu Yeh Che Kuan Lin Chen Yun Hsieh

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-sha...

Journal: :Scientific American 1898

Journal: :Journal of The Surface Finishing Society of Japan 2018

Journal: :Journal of Industrial & Engineering Chemistry 1915

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