ELECTROLESS DEPOSITION OF SUPERCONDUCTING MAGNESIUM DIBORIDETHIN FILMS ON VARIOUS SUBSTRATES

For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...

Metal nanowire (MNW) transparent electrodes have been widely developed for their promising sheet resistance (R(s))-transmittance (T) performance, excellent mechanical flexibility, and facile synthesis. How to lower the junction resistance without compromising optical transmittance has become the key issue in enhancing their performance. Here we combine electrospinning and electroless deposition...

Cu 2 O/Si radial nanowire (NWs) array heterojunctions were prepared by depositing O nanoparticles via chemical bath deposition on n-Si arrays that fabricated metal-assisted electroless etching. After 20 cycles of deposition, large numbers with form shells wrap the upper segment each Si nanowire. This method etching offers exceptional simplicity, flexibility, environmental friendliness, and scal...

The electroless coating technique is one of the elegant methods available for the production of protective coatings on surface. Our study has been aimed at the conditions of the electroless deposition of copper coating onto the iron powder particles from sulphate electrolyte. The course of the electroless process depends on the composition and pH of the electrolyte as well as on the size and co...