Annealing Cu and dilute Cu(Ti), Cu(Sn) and Cu(Al) alloy films resulted in the strengthening of film texture, with the strongest <111> fiber texture being found for Cu(Ti). Annealing also resulted in a decrease of electrical resistivity and the growth of grains, with the largest grain size and lowest resistivity being seen for pure Cu itself. Among the alloy films, the lowest resistivity was fou...

This study is an investigation of the machinability of experimental Ti-Cu alloys (2, 5, and 10mass% Cu) as new dental titanium alloy candidates for CAD/CAM use. The alloys were slotted with a vertical milling machine and carbide square end mills under two cutting conditions. Their machinability was evaluated through cutting force using a three-component force transducer fixed on the table of th...

Most micro-electro-mechanical systems (MEMS) devices contain fragile moving parts, which poses challenges in process integration of interconnection methods requiring wet-chemistry, such as solid-liquid interdiffusion bonding (SLID). These sensitive MEMS structures can be protected from either the wet-chemistry or plated metals during chemical/electro-chemical plating SLID materials; however, th...

Our investigations reveal that the bonding of the transition-metal atoms on a single-wall carbon nanotube ~SWCN! depends on the detailed contact conditions. On the basis of our results, we suggest that the early 3-d elements ~Sc, Ti, and V! can be expected to be good candidates for making metal–SWCN contacts of low resistance, while contacts employing the late 3-d elements ~Fe, Co, and Ni! and ...

A tubular array of TiO2 nanotubes on Ti matrix was used as a support for Ag or Cu sputter-deposited layers intended for surface-enhanced Raman scattering (SERS) investigations. Composite samples of Ag/TiO2-nanotube/Ti and Cu/TiO2nanotube/Ti were studied with the aid of scanning electron microscopy (SEM) and Auger electron spectroscopy (AES and SAM) to reveal their characteristic morphological a...

This Thesis concerns the advanced surface engineering of novel TiC-based nanocomposite and AgI electrical contact materials. The objective is to make industrially applicable coatings that are electrically conductive and wear-resistant, and have a low coefficient of friction. I have studied electrical contact systems consisting of a Cu substrate with a Ni diffusion barrier and loading support, a...

This study focuses on the fabrication and microstructural investigation of Cu–TiH2–C and Cu–Ti–C nanocomposites with different volume fractions (10% and 20%) of TiC. Two mixtures of powders were ball milled for 10 h, consequently consolidated by spark plasma sintering (SPS) at 900 and 1000 ◦C producing bulk materials with relative densities of 95–97%. The evolution process of TiC formation duri...

The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the s...

The effect of Ti addition on the microstructure and mechanical properties of Cu-15Ni-8Sn alloys was investigated. Optical microscopy (OM), scanning electronic microscopy (SEM), and transmission electron microscopy (TEM) were used to determine grain size and distribution of the second phases in the alloys. The results indicate that the tensile properties of Cu-15Ni-8Sn alloys are improved signif...

Annealing of dilute binary Cu(Ti), Cu(In), Cu(Al), Cu(Sn), Cu(Mg), Cu(Nb), Cu(B), Cu(Co) and Cu(Ag) alloy films resulted in the strongest <111> fiber texture for Cu(Ti) and the lowest resistivity for Cu(Ag). The behavior of the alloy films was compared and contrasted with that for a pure evaporated Cu film. Electron beam evaporated films with compositions in the range of 2.0-4.2 at% and thickne...