To solve the main problems of existing coarse grained copper (CG Cu) intrauterine devices (IUD)-namely burst release and a low transfer efficiency of the cupric ions during usage-ultra-fine grained copper (UFG Cu) and single crystal copper (SC Cu) have been investigated as potential substitutes. Their corrosion properties with CG Cu as a control have been studied in simulated uterine fluid (SUF...

Today, the price of building a factory to produce submicron size electronic devices on 300 mm Si wafers is over billions of dollars. In processing a 300 mm Si wafer, over half of the production cost comes from fabricating the very-large-scale-integration of the interconnect metallization. The most serious and persistent reliability problem in interconnect metallization is electromigration. In t...

The aggregation of alpha-synuclein (AS) is characteristic of Parkinson's disease and other neurodegenerative synucleinopathies. We demonstrate here that Cu(II) ions are effective in accelerating AS aggregation at physiologically relevant concentrations without altering the resultant fibrillar structures. By using numerous spectroscopic techniques (absorption, CD, EPR, and NMR), we have located ...

A Fe-Cu-Al-O water gas shift catalyst with a Fe : Cu atomic ratio of 4 : 1 upon pretreatment at 350 °C in H2 exhibits a conversion higher than a physical mixture of Fe-Al-O and Cu-Al-O by ~40% over a temperature range of 300 °C-450 °C. In situ ambient pressure X-ray photoelectron spectroscopy studies suggest that the surface region of Fe-Cu-Al-O was restructured into a double-layer structure co...

The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermocompression bonded dice at 10μm and 15μm pitch in large area arrays are shown. The interconnect bonding process pressure and temperature required for the formation of low resistance (<100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. In the case of Cu/Sn-Cu, use of a m...

In this paper, we show that the onset potential for CO oxidation electrocatalyzed by ∼2 nm dendrimer-encapsulated Pt nanoparticles (Pt DENs) is shifted negative by ∼300 mV in the presence of a small percentage (<2%) of Cu surface atoms. Theory and experiments suggest that the catalytic enhancement arises from a cocatalytic Langmuir-Hinshelwood mechanism in which the small number of Cu atoms sel...

Non-noble metals, such as Cu and Co, as well as noble metals, such as Au, can be used in a number modern technological applications, which include advanced scanning-probe systems, magnetic memory and storage, ferroelectric tunnel junction memristors, metal interconnects for high performance integrated circuits in microelectronics and nano-optics applications, especially in the areas of plasmoni...

The results of EXAFS measurements at 300 K for the superconducting compounds Tl0.75Cu0.25Ba2Ca3Cu4Oy [Tl-1234], TlBa2Ca3Cu4Oy [Tl-1212], and CuBa2Ca3Cu4Oy [Cu-1234]. are reported. We have measured the EXAFS spectrum for Tl0.75Cu0.25Ba2Ca3Cu4Oy in the range 10K-300K, however here we limit our discussion to the spectrum at 300 K. This material is prepared under high pressure [3.5 GPa] from precur...

For Fe films epitaxially grown on Cu(100) at 300 K, the total magnetic moment as a function of film thickness and its temperature dependence have been investigated in situ with a multitechnique approach. The results exclude the collinear type-1 antiferromagnetic configuration as the magnetic structure for face-centered-cubic Fe films on Cu(100). It is proposed that a spin-density-wave state is ...