Ni-implantation has been conducted for sputter deposited Zr alloy films to investigate compositional dependent amorphization behavior in proportion to Ni in Zr alloys. As-deposited Zr and Zr–Cu with thickness of 200 nm shows columnar hcp-Zr and nano-crystalline hcp-Zr(Cu), respectively. Implantation of 150 keV Niþ with the amount of 1 10 ions/cm induces amorphization of Zr and Zr(Cu) with 100 n...

The kinetics of the solid-state reactive diffusion between Sn­Ni alloys and pure Cu was experimentally observed to examine effects of addition of Ni into Sn on the growth behavior of compounds at the interconnection between the Sn-base solder and the multilayer Au/Ni/Cu conductor during energization heating. In this experiment, sandwich (Sn­Ni)/Cu/(Sn­Ni) diffusion couples with Ni concentration...

We find that the photoelectron angular distributions from the Fermi surface of a monolayer Ni film on Cu are identical to those from thick Ni films and single-crystal Ni(001), and agree well with theoretical predictions for bulk Ni. This bulklike behavior in the monolayer film is attributed to the short screening length of electrons in metals, the similarity of the Ni and Cu cores, and a hybrid...

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from 135C to 165C. The UBM structures were examined: 5-μm-Cu/3-μm-Ni and 5 μm Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the differen...

The occurrence of nickel (Ni) deficiency of pecan [Carya illinoinensis (Wangenh.) K. Koch] in orchards is an increasingly common problem. There is uncertainly regarding the primary cause of the problem, as orchard soils have plenty of Ni. The influence of essential micronutrients on the endogenous bioavailability of Ni is unknown and is a possible factor triggering Ni deficiency. This study exa...

Biomedical materials can improve the life quality of a number of people each year. The range of applications includes such as joint and limb replacements, artificial arteries and skin, contact lenses, and dentures. So far the accepted biomaterials include metals, ceramics and polymers. The metallic biomaterials mainly contain stainless steel, Co-Cr alloys, Titanium and Ti-6Al-4V. Recently, bulk...

A family of [RE2M2L2(BA)6] (RE = Gd, Tb, Dy, Y; M = Co, Ni, Cu, Zn; L = 1,2-bis(2-hydroxy-3-methoxybenzylidene)hydrazine; BA = benzoic acid) complexes were synthesized and structurally and magnetically characterized. The magnetic interactions between spin centers were systematically investigated. The interactions of M-M (M = Co, Ni and Cu) and Gd-Ni/Cu were extracted from the fitting of the exp...

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...