Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include...

In plasma etching equipment for microelectronics fabrication, there is an engineered gap between the edge of the wafer and wafer terminating structures, such as focus rings. The intended purpose of these structures is to make the reactant fluxes uniform to the edge of the wafer and so prevent a larger than desired edge exclusion where useful products cannot be obtained. The wafer-focus ring gap...

In a state-of-the-art industrial production line of photovoltaic products the handling and automation processes are of particular importance and implication. While processing a fully functional crystalline solar cell an as-cut photovoltaic wafer is subject to numerous repeated handling steps. With respect to stronger requirements in productivity and decreasing rejections due to defects the mech...

As a key element in the semiconductor industry, efficient and stable transfer of the wafer set the very high request to the wafer transfer manipulator.At present,wafer transfer robot(SCARA-type,R-θ type) widely used in IC manufacturing equipment can only realize translational transmission to wafer,can not realize the posture change.So wafer transfer acceleration can only rely on its own gravity...

Because of the pressure of globalization in the last two decades, professional services has become an important strategic decision so that supplier selection is a prime concern. In the semiconductor industry, the prior researches worked on analyzing and improving the process, and evaluating the equipment manufacturers. Therefore, being the semiconductor industry applying a wide huge of advanced...

Silicon-on-insulator (SOI) wafers are nowadays being prominently used for the manufacture of new generation semiconductor devices. In order to maximize the device yield, the device industry is seeking SOI wafers that meet very stringent wafer specifications such as very low wafer bow and warp. An SOI wafer can undergo severe process-induced stresses during its manufacture leading to significant...

Silver nanoparticle deposition from suspension is proposed as a route for the morphological design of controllably disordered self-affine substrates for surfaceenhanced Raman sensing of water pollutants. Ionic strength is used as a variable parameter to control the deposition process and, ultimately, the morphology of deposited substrates. The critical dependence of the enhancement factor on th...

Heterojunction solar cells have potential for very high device voltages and currents, yet this relies on correct preparation of wafer surfaces prior to a-Si deposition. This paper investigates the preparation of wafer surfaces by NaOH texturing prior to amorphous silicon intrinsic layer deposition. It is found that with a CP etch or low temperature anneal after texturing, and with correct depos...