In this paper, an analytical method is developed to obtain the solution for the one dimensional transient thermal and mechanical stresses in a hollow cylinder made of functionally graded material (FGM) and piezoelectric layers. The FGM properties are assumed to depend on the variable r and they are expressed as power functions of r but the Poisson’s ratio is assumed to be constant. Transient te...

The present study aims to investigate the analysis of stress, strain, displacement, and electrical potential of a thick hollow cylinder made of FGPM under mechanical and thermal loads. Distribution of mechanical property of material is considered along the shell stick through the power distribution function. Thermal loads have been taken to signify the difference of temperature between outer an...

Convective heating and cooling of the surfaces find application in process industry. During the heating or cooling cycle of the process, thermodynamic irreversibility which can be associated with the process parameters occurs. Moreover, thermodynamic irreversibility associated with the heating cycle can be quantified through entropy analysis. In the present study, convective heating of the soli...

We use a self-consistent strong-coupling expansion for the self-energy (perturbation theory in the hopping) to describe the nonequilibrium dynamics of strongly correlated lattice fermions. We study the three-dimensional homogeneous Fermi-Hubbard model driven by an external electric field showing that the damping of the ensuing Bloch oscillations depends on the direction of the field and that fo...

The dynamics of laser heating and melting of Si in UHV is investigated by transient reflectivity with single pulse sensitivity. It is found that the heating and melting dynamics cannot be accounted for by a model of heat flow using the thermal and optical properties of Si. Experiment and theory can be reconciled assuming significantly smaller thermal conductivity and heat capacity at all temper...

1. Abstract This paper describes a hierarchical computational model to optimize the material distribution and the local material properties of thermo-mechanical structures within the context of transient thermal conduction problems. The problem formulation assumes a given domain, prescribed thermal boundary and initial conditions, and the objective is to identify the non-homogeneous material th...

The Wiener-Hopf and Cagniard-de Hoop techniques are employed in order to solve a range of transient thermal mixed boundary value problems on the halfspace. The thermal field in the half-space is determined via a rapidly convergent integral, which can be evaluated straightforwardly and efficiently. Model problems are considered before the specific application areas of heat loss from buildings in...

A major concern of current and future on-chip systems is the thermal problem i.e. electrical energy is dissipated leading to high chip temperatures. Short term effects may include transient malfunctioning whereas long-term effects may lead to deteriorating functionality (e.g. increased signal travel times) or to irreversible damage due to, for example, electro-migration. The problem worsens wit...

[1] Knowledge of frictional resistance along faults is important for understanding the mechanics of earthquakes and faulting. The clearest in situ measure of fault friction potentially comes from temperature measurements in boreholes crossing fault zones within a few years of rupture. However, large temperature signals from frictional heating on faults have not been observed. Unambiguously inte...