One of major reasons of failure of solder joints is known as the thermal fatigue. Also, The failure of the solder joints under the thermal fatigue loading is influenced by varying boundary conditions such as the material of solder joint, the materials of substrates(related the difference in CTE), the height of solder, the Distance of the solder joint from the Neutral Point (DNP), the temperatur...

Although the primary driver for the current interest in developing lead-free soldering is global market pressure for more environmentally friendly products, the main concern continues to be lead contamination from end-of-life electronic products in landfill sites. In response to existing and impending legislation in Europe and Japan for the elimination of lead from electronic products, the indu...

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...

Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile elect...

Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re­ liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa­ cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...

Due to the consideration of environmental protection policy, all electronic products are requested to be lead free. In package field, solder ball is also requested to be lead free and currently the most popular type of solder ball is the Sn/Ag/Cu solder [1]. Sn/Ag/Cu solder has higher melting point and weaker wettability [2-3] during IR re-flow profile than eutectic solder ( Sn/Pb ), therefore ...

The trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more, higher density inputs/outputs (I/Os), leads to the use of area array packages using chip scale packaging (CSP), flip chip (FC), and wafer level packaging (WLP) technologies. Greater attention has been paid to the reliability of solder joints and the assembly yield of the surf...

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resisto...

Understanding the mechanical degradation of microelectronic solder joints under high electric current stressing is an important step to develop a damage mechanics model in order to predict the reliability of a solder joint under such loading. In this paper, the experiment results for flip chip solder joints under high current stressing are reported. Nanoindentation tests suggest that mechanical...

In this paper, we described an approach ,to automation of visual inspection of solder joint defects of SMC(suface mounted components) on PCBs (Printed Circuit Board) by using neural network and fizzy rule-based classification method. Inherent&, suface of the solder joints is curved, tiny and specular reflective; it induces a difiiccul~ of taking good image of the solder joints. And the shape of...