Eutectic Sn–Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten conventional eutectic Sn–Pb solder having different volumes. BGA solder ball of 760 and 500 m of di...

Keywords: Shear strength Microstructure Single-shear lap joint Intermetallic compound (IMC) Aging a b s t r a c t The effects of isothermal aging on the microstructure and shear strength of Sn37Pb/Cu solder joints were investigated. Single-lap shear solder joints of eutectic Sn37Pb solder were aged for 1–10 days at 120 °C and 170 °C, respectively, and then loaded to failure in shear with a cons...

An investigation on the solder bumped Flip Chip on Printed Circuit Board (FCOB) is presented in this paper. The emphasis is placed on the effects of delamination crack between the underfill encapsulant and the solder mask on the solder joint reliability of FCOB. In the present study, a fracture mechanics approach is employed. The strain energy release rate at the crack tip between the underfill...

In this paper, we described an approach ,to automation of visual inspection of solder joint defects of SMC(suface mounted components) on PCBs (Printed Circuit Board) by using neural network and fizzy rule-based classification method. Inherent&, suface of the solder joints is curved, tiny and specular reflective; it induces a difiiccul~ of taking good image of the solder joints. And the shape of...

In this paper, the Moir e interferometry technique is used to measure the in situ displacement evolution of lead-free solder joint under electric current stressing. Large amounts of deformation were observed in the solder joint under high density (above 5000 A/cm) current stressing. The deformation was found to be due to electromigration in the solder joint and an electromigration constitutive ...

Incorporation of metallic particulate reinforcements in eutectic Sn-Ag solder re­ sults in the formation of intermetallic compounds (IMCs) along particulate/ solder interfaces with different morphologies. For instance, “sunflower” and “blocky faceted” IMC shapes have been observed around Ni particle reinforce­ ments incorporated in the eutectic Sn-Ag solder matrix. The time and tempera­ ture ab...

In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...

Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. ...

0026-2714/$ see front matter 2009 Published by doi:10.1016/j.microrel.2009.03.001 * Corresponding author. Tel.: +886 3573 1814; fax: E-mail address: [email protected] (C. Chen). Three dimensional thermo-electrical analysis was employed to simulate the current density and temperature distributions for eutectic SnAg solder bumps with shrinkage bump sizes. It was found that the current crowdin...

The fracture of SAC305 solder was investigated as a function of strain rate using Cu-solder-Cu double cantilever beam (DCB) specimens joined with a series of 2 mm long discrete solder joints of 150 m thickness. The joints were then fractured with various strain rates under mode I and mixed-mode loading conditions. The failure of each joint in the DCB was accompanied by a sharp drop in the appli...