نتایج جستجو برای: shrink fitting

تعداد نتایج: 50386  

Journal: :IEEE Micro 1997
Richard H. Stern

Journal: :JSME international journal. Ser. 1, Solid mechanics, strength of materials 1991

Nowadays, functionally graded materials (FGM) are widely used in many industrial, aerospace and military fields. On the other hand, the interest in the use of shrink-fitted assemblies is increasing for designing composite tubes, high-pressure vessels, rectors and tanks. Although extensive researches exist on thick-walled cylindrical shells, not many researches have been done on shrink-fitted th...

1985
J. R. BARBER

Duplex heat exchanger tubes consist oftwo concentric cylinders assembled in a state ofprestress by shrink fitting. During operation, thermal expansion changes the interface pressure and this can cause a substantial increase in the thermal resistance of the tube. Under certain circumstances, more than one steadystate solution can be obtained. In this paper, the effect of this mechanism on the ax...

1999
Francis Bordeleau

An analysis of 2 team-organization models when developing consumer-level shrink-wrapped software.

Journal: :Materials Today 2012

Journal: :تحقیقات مهندسی کشاورزی 0
فرشته سلاجقه کارشناس بخش تحقیقات فنی و مهندسی کشاورزی مرکز تحقیقات کشاورزی و منابع طبیعی استان کرمان

the effects of chemical and physical treatments on the storage life of bitter lemons in jiroft, kerman province, were investigated. after harvesting, the lemons were treated by curing, fungicide, waxed paper, shrink wrap or using a combination of these treatments. the samples were stored in standard citrus fruit boxes for three months at 85-90% relative humidity at a temperature of 3°c. once a ...

2003
Michael Creutz

I discuss some of the historical circumstances that drove us to use the lattice as a nonperturbative regulator. This approach has had immense success, convincingly demonstrating quark confinement and obtaining crucial properties of the strong interactions from first principles. I wrap up with some challenges for the future.

Journal: :Microelectronics Reliability 2015
Hao Cai You Wang Lirida A. B. Naviner W. S. Zhao

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