نتایج جستجو برای: readout circuit

تعداد نتایج: 121805  

Journal: :Journal of Sensor Science and Technology 2014

2001
Khaled Salama Abbas El Gamal

ABSTRACT The paper provides a complete analysis of the APS pixel and column circuit delay. Contrary to common belief, we show that shorter settling times can be achieved by reducing the bias current and hence reducing energy consumption. We then investigate the effect of non-idealities on the readout operation. We find that when the follower transistor channel length modulation is taken into co...

2009
Sha Xia Jeroen P. van Schieveen Stoyan Nihtianov Jo W. Spronck

This paper addresses the challenges related to the design of a high-resolution, low-latency capacitive displacement sensor. An auto-alignment mechanism of the sensor head is proposed which relaxes the resolution requirement of the readout circuit. Different interfacing principles are investigated and analyzed, and the advantage of using a switched-capacitor readout topology for a specific appli...

Journal: :International Journal of Electronics and Telecommunications 2014

2015
Daniel Arbet Viera Stopjaková Martin Kováč Lukáš Nagy Gabriel Nagy G. NAGY

This paper deals with a frontend part of the readout circuit developed as an integrated circuit that after bonding together with a MEMS capacitive microphone (MCM) chip will be used in a noise dosimeter applicable in very noisy and harsh environment, e.g. mine. Therefore, the main attention has been paid to the high dynamic range, low offset and low noise of the developed readout interface as w...

2000
A. Srivastava S. V. Prasanna P. K. AJMERA

A digital readout electronics scheme in CMOS technology is described for integration with micro-electro-mechanical (MEM) sensors on the same chip. The readout circuit is general in nature and can be employed with a variety of analog sensors. The presented scheme in CMOS technology is fully integrable with the multiple sensor outputs either in a chain or an array format and is capable of detecti...

2001
S. Zimmermann G. Cardoso J. Andresen J. A. Appel G. Chiodini D. C. Christian B. K. Hall J. Hoff S. W. Kwan A. Mekkaoui R. Yarema

At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this...

نمودار تعداد نتایج جستجو در هر سال

با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید