Laser polishing is a finishing process based on melting material, with the objective of improving surface topography. Some operating parameters must be taken into consideration, such as laser power, feed rate, offset, and overlapping. Moreover, because of its dependence on the primary process, the initial topography has also an impact on the final result. This study describes a quadratic model,...

The purpose of this study was to evaluate the effect of polishing procedures on the color stability of different types of composites after aging. Forty disk-shaped specimens (Ø10×2 mm) were prepared for each composite resin type (an ormocer, a packable, a nanohybrid, and a microhybrid) for a total of 160 specimens. Each composite group was divided into four subgroups according to polishing meth...

The next generation ground-based giant telescope, the European Extremely Large Telescope (E-ELT), under development by the European Southern Observation (ESO) , will have nearly 1000 hexagonal segments of 1.45m across the flats. Fast processing of these segments with high form and edge specifications has proven to be a challenge. The Zeeko Precessions sub-aperture bonnet polishing plays an impo...

Chemical-vapor-deposited (CVD) ZnS is an example of a polycrystalline material that is difficult to polish smoothly via the magnetorheological finishing (MRF) technique. When MRF-polished, the internal infrastructure of the material tends to manifest on the surface as millimeter-sized "pebbles," and the surface roughness observed is considerably high. The fluid's parameters important to develop...

In many works on the material removal in the Chemical Mechanical Process (CMP), the effects of several process parameters have been addressed. However, a thorough understanding of the mechanisms of material removal and a model to correlate the process parameters to material removal rate (MRR) are still lacking. This appendix develops such models for polishing based on the results from the pin-o...

INTRODUCTION Interactions of the ceria particles with polyurethane surfaces are of great interest for polishing processes used in modern semiconductor industry. Specifically, ceria abrasive nanoparticles and polyurethane polishing pads are now broadly used in the process called Chemical-Mechanical Planarization/Polishing (CMP) [1,2,3]. To optimize the process of CMP, various chemicals, abrasive...

This paper presents a polishing expert system integrated with sensor information which can modify the polishing sequence and conditions initially set by the system using the on-site polishing status. A practical system using AE sensors is developed for the rotational polishing and the curved surface polishing. A database and knowledge base for polishing processes are established by using the re...

This investigation aims to develop a quantitative model to estimate the material removal of polycrystalline diamond composites (PCDCs) by dynamic friction polishing. The model accounts for the contributions from the constitutive characteristics and thermal properties of the materials and the key polishing parameters. It was found that the material removal was dominated by six dimensionless vari...