We report a molecular dynamics simulation study of the properties of the potential energy landscape sampled by a system of water molecules during the process of generating a glass by cooling, and during the process of regenerating the equilibrium liquid by heating the glass. We study the dependence of these processes on the cooling/heating rates as well as on the role of aging (the time elapsed...

In this paper, a new tank with cryogenic charging (liquid nitrogen) is introduced. On the basis of this tank it is proposed to create a throttle cooling system, which may have enhanced characteristics compared with a throttle cooling system based on high pressure tank. This article deals with first results of tests of a tank with cryogenic charging (liquid nitrogen), which have been made at lev...

A numerical and experimental investigation was conducted to analyze dropwise evaporative cooling of heated surfaces with various wettability characteristics. The surface wettability was tuned by nanostructure modifications. Spray-cooling experiments on these surfaces show that surfaces with better wettability have better heat transfer rate and higher critical heat flux (CHF). Single droplet imp...

The main objective of this study was to develop a thermoelectric heat pump and liquid desiccant system based on a dedicated outdoor air system (THPLD-DOAS). An internally-cooled and -heated liquid desiccant system was used and a thermoelectric heat pump (THP) served as the desiccant cooling and heating energy source for dehumidification and regeneration of the desiccant solution, respectively. ...

3D stacked architectures are getting increasingly attractive as they improve yield, reduce interconnect power and latency, and enable integrating layers manufactured with different technologies on the same chip. However, 3D integration results in higher temperatures following the increase in thermal resistances. This chapter discusses thermal modeling and management of 3D systems with a particu...

The power dissipation levels in high performance personal computers continue to increase rapidly while the silicon die temperature requirements remain unchanged or have been lowered. Advanced air cooling solutions for the major heat sources such as CPU and GPU modules use heat pipes and high flow rate fans to manage the heat load at the expense of significant increases in the sound power emitte...

The temperature of an electronics device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000W/cm in the near future. This paper study explored the benefit of cooling the electronics device using indirect refrigeration cooling system .In this system the heat sink in a prima...