Although the primary driver for the current interest in developing lead-free soldering is global market pressure for more environmentally friendly products, the main concern continues to be lead contamination from end-of-life electronic products in landfill sites. In response to existing and impending legislation in Europe and Japan for the elimination of lead from electronic products, the indu...

In this study, an addition of Ag micro-particles (8–10 lm) with a content in the range between 0 and 1.5 wt.% to Sn–9Zn eutectic solder, were examined in order to understand the effect of Ag additions as the particulate reinforcement on the microstructural and mechanical properties as well as the thermal behavior of the newly developed composite solders. Here, an approach to prepare a micro-com...

in the present study, nanocrystalline ni50al50-xmox (x = 0, 0.5, 1, 2.5, 5) intermetallic compound was produced through mechanical alloying of nickel, aluminum, and molybdenum powders. alni compounds with good and attractive properties such as high melting point, high strength to weight ratio and high corrosion resistance especially at high temperatures have attracted the attention of many rese...

Detailed density functional theory (DFT) calculations of the adsorption energies (Ead) for oxygen on monolayer Pd on top of the Pd-Cu face-centered cubic (FCC) alloy and intermetallic B2 structure revealed a linear correspondence between the adsorption energies and the d-band center position. The calculated barrier (Ebarrier) for oxygen dissociation depends linearly on the reaction energy diffe...

The study focuses on the critical interlayer thickness for averting pore formation during transient liquid phase (TLP) bonding in the Cu–Sn system. Such pores are a consequence of the growth and subsequent contact of Cu6Sn5 intermetallic grains on the two surfaces to be bonded, prior to the formation of the transient liquid phase. A criterion for the critical interlayer thickness is developed, ...

Bulk metallic glasses (BMGs) and nanocrystalline metals (NMs) have been extensively investigated due to their superior strengths and elastic limits. Despite these excellent mechanical properties, low ductility at room temperature and poor microstructural stability at elevated temperatures often limit their practical applications. Thus, there is a need for a metallic material system that can ove...

Intermetallic compounds are increasingly being expected to be utilized in tribological environments, but to date their implementation is hindered by insufficient ductility at low and medium temperatures. This paper presents a novel multiphase intermetallic alloy with the chemical composition of Mo-40Ni-13Si (at %). Microstructure characterization reveals that a certain amount of ductile Mo phas...

abstractin this paper, we investigate effect of fe–intermetallic compounds on plastic deformation of closed-cell composite aluminum foam as filler of thin-walled tubes. however, deformation of the aluminum foam-filled thin-walled tubes as crushed-box will be presented in part (ii). composite foams of alsi7sic3 and alsi7sic3-(fe) as closed cell were synthesized by powder metallurgy foaming metho...

The past two decades have seen alloys based upon intermetallic phases evolve from the status of scientifically interesting materials with a range of attractive properties, combined with overriding disadvantages, to that of the next generation of advanced engineering alloys. This evolution, which has been achieved through a very significant research and development effort on a world wide front, ...