With the constant improvement of electrical equipment automation level, unattended electric power system node becomes increasingly popular. In addition, because of the ever-increasing industrial demand for electricity, electric power infrastructure becomes larger and larger, equipment and transmission link structure are more and more complex, all kinds of faults emerge one after another and adm...

In order to meet the defect-detection requirements of chips in high-precision surface mount technology (SMT) equipment widely used electronic industry, a chip appearance method based on multi-order fractional discrete wavelet packet decomposition (DWPD) is proposed this paper. First, lead and body regions were extracted from images using image segmentation algorithm with asymmetric Laplace mixt...

Pulsed eddy current inspection techniques were derived from the conventional eddy current testing technology, based on the fundamental principle of an eddy current coil, but using periodic ultrasound pulses. The authors first introduce the principle of pulsed eddy current inspection and some experimental measurement results using pulsed eddy current equipment. This technology can be applied to ...

Defects on the backside of a wafer during processing can come from many sources. Particles and scratches on the backsides of wafers can be caused by wafer handling equipment such as robots and chucks, as well as by CMP processes. In addition, cross-contamination of wafers and handling equipment can occur when wafers move from tool to tool, through the production line. When wafers are exposed, b...