Use of a phase change material (PCM)-based heat sink in transient thermal management of plastic quad flat package (QFP) electronic devices was investigated experimentally and numerically. Results show that increased power inputs enhance the melting rate as well as the thermal performance of the PCM-based heat sinks until the PCM is fully melted. A three-dimensional computational fluid dynamics ...

Microchannel heat sinks are widely regarded as being amongst the most effective heat removal techniques from space-constrained electronic devices. However, the fluid flow and heat transfer in microchannels is not fully understood. The pumping requirements for flow through microchannels are also very high and none of the micropumps in the literature are truly suitable for this application. Resul...

Boiling water in small channels that are formed along turbine blades has been examined since the 1970s as a means to dissipating large amounts of heat. Later, similar geometries could be found in cooling systems for computers, fusion reactors, rocket nozzles, avionics, hybrid vehicle power electronics, and space systems. This paper addresses (a) the implementation of two-phase microchannel heat...

Two differently-produced open-cell aluminum foams were compared to a commercially available finned heat sink. Further, an aluminum plate and block were tested as a reference. All heat sinks have the same base plate dimensions of four by six inches. The first foam was made by investment casting of a polyurethane preform and has a porosity of 0.946 and a pore density of 10 pores per linear inch. ...

Multiple loop heat pipes which have two evaporators and two condensers in one loop are a kind of active heat transfer device. Since they have two evaporators and two condensers, the operating mode also becomes multiple. This work discusses the cases that multiple loop heat pipes were operated with one condenser at high temperature and the other at low temperature. To avoid the high temperature ...

This paper reports on novel thermal testbeds with embedded micropin-fin heat sinks that were designed and microfabricated in silicon. Two micropin-fin arrays were presented, each with a nominal pin height of 200 lm and pin diameters of 90 lm and 30 lm. Singlephase and two-phase thermal testing of the micropin-fin array heat sinks were performed using de-ionized (DI) water as the coolant. The te...

This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling...