نتایج جستجو برای: grinding

تعداد نتایج: 8022  

Journal: :journal of modern processes in manufacturing and production 0
vahid barahimi department of mechanical engineering, najafabad branch, islamic azad university, najafabad, iran masoud farahnakian 1department of mechanical engineering, najafabad branch, islamic azad university, najafabad, iran

surface roughness is a significant parameter which determines the efficiency of optical components. surface damages induced by grinding strongly influence the mechanical strength and optical quality of optical glasses. it is meaningful to rapid evaluate the surface roughness through the measurement of different grinding parameters. in this study, a cup diamond wheel (d64) is used in grinding pr...

Journal: :Journal of food science 2010
J Baggenstoss D Thomann R Perren F Escher

Aroma recovery as determined by solid phase microextraction-gas chromatography-mass spectrometry (SPME-GC-MS) was compared in coffees resulting from conventional grinding processes, and from wet grinding with cold and hot water. Freshly roasted coffee as well as old, completely degassed coffee was ground in order to estimate the relationship of internal carbon dioxide pressure in freshly roaste...

2017
Nian Zhou Ru Lin Peng Rachel Pettersson

Background: The austenitic stainless steel 304L is widely used as a structural material for which the finished surface has significant effect on the service performance. A study of the grinding process with regard to the quality of the ground surfaces is therefore interesting from the point of view of both industrial application and scientific research. Method: This work investigates the influe...

Journal: :IJMTM 2005
Jeremiah A. Couey Eric R. Marsh Byron R. Knapp R. Ryan Vallance

Forces generated during precision wafer grinding are small and present challenges for accurate and reliable process monitoring. In this work, these challenges are met by incorporating noncontact displacement sensors into an aerostatic spindle that is calibrated to measure grinding forces from the relative motion between the spindle rotor and stator. This arrangement allows the calculation of gr...

2017
Andrea Mascitti Massimiliano Lupacchini Ruben Guerra Ilya Taydakov Lucia Tonucci Nicola d’Alessandro Frederic Lamaty Jean Martinez Evelina Colacino

The mechanochemical preparation of highly functionalized 3,5-disubstituted hydantoins was investigated in the presence of various poly(ethylene) glycols (PEGs), as safe grinding assisting agents (liquid-assisted grinding, LAG). A comparative study under dry-grinding conditions was also performed. The results showed that the cyclization reaction was influenced by the amount of the PEG grinding a...

2005
W. Lin H. Ohmori T. Suzuki Y. Uehara S. Morita

This paper describes an ultra precision polishing method of aspherical mirrors, and the fundamental research on polishing characteristics. The aspherical mirrors with a diameter of about 30mm made by fused silica glass and CVD-SiC were ELID (electrolytic in-process dressing)-ground to high form accuracy with #4000 cast iron bonded diamond wheel, and then polished with a small polishing tool. As...

2009
S. Prabhu B. K. Vinayagam

Recent developments in grinding have opened up new avenues for finishingof hard and brittle materials with Nano-surface finish, high tolerance and accuracy.Grinding with super abrasive diamond wheels is an excellent way to produce ultraprecision surface finish. However, super abrasive diamond grits need higher bondingstrength while grinding, which metal-bonded grinding wheels ca...

2005
Stephen Malkin Yoram Koren

conputer pror,rae1 descrihed for practical optinization plun?;e grindin>; on steels. Tl1e program based on a strategy desiv,ned to o;Hi!'1ize both the grinding and dress "~nr, <Jara!'1eters maxil'1um metal removal rate, to constraints of surface finish and burning of the Forkpiece. The operates with a desktop micro-computer. performin?: the optimization, the user inputs the present grinding dre...

2008
G. J. Liu Y. D. Gong W. S. Wang

A on-line monitoring new method for grinding quality is presented based on theory analysis and test study, which collects the information of grinding quality from the AE signals produced by friction and grinding process to realize the on-line intelligent detection and prediction of grinding quality by A wavelet neural network & Fuzzy BP algorithm based network. The reliability and feasibility o...

2009
Z. J. Pei Graham R. Fisher

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

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