نتایج جستجو برای: adhesive capsulaitis
تعداد نتایج: 23299 فیلتر نتایج به سال:
Background and Aim: With the increase of elderly population nowadays, the prevalence of denture stomatitis has increased, the etiology of which is Candida albicans .Due to the effectiveness of antifungal drugs to treat this disease. The purpose of this study was Evaluation of antifungal effect of denture adhesive after combination with three separate substances, chlorhexidine, nystatin and cham...
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mucosa-adhesive gels can be used as a useful mean of delivering drugs to or via mucosal membranes, and in particular buccal mucosa. carbomers are among the best mucosa-adhesive materials known. the aim of this study was to compare the results obtained from the mucosa-adhesive strength of aqueous gels containing carbomers, either alone or in combination, to the data obtained from assessing the d...
Introduction: Nowadays, the main focus of dental studies is on adhesive dental materials; since clinical long-term success of bonded restorations depended more on marginal microleakage minimization. So, the aim of this study was Evaluation of Diode laser irradiation effect on microleakage in class V composite restoration before and after adhesive application. Materials and methods: In this in v...
objectives: this study aimed to evaluate the effects of saliva contamination on the metallic bracket microleakage bonded with two moisture-tolerant bonding systems. materials and methods: ninety freshly extracted premolar teeth were randomly divided into six groups of 15 with the following treatments: g1 (control): after acid etching, assure primer and assure adhesive were applied to non-conta...
Background: The clinical success of sandwich technique depends on the strength of resin-modified glass ionomer cement (RMGIC) bonding to both dentin and resin composite. Therefore, the shear bond strength (SBS) of resin composite bonded to RMGIC utilizing different resin adhesives versus a GIC-based adhesive was compared. Materials and methods: In this in vitro study, 84 holes (5×2 mm) were pre...
For microoptics and microsystem assembly, solder bumping is introduced as a flexible and high precise joining alternative to adhesive bonding, especially if adhesives limit the system performance in terms of long term, high temperature, vacuum or UV stability. The bumping technology, which is based on jetting the liquid solder onto wetting surfaces, can be parameter optimised to work in complex...
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