1 Ph.D. Candidate 2 Corresponding Author, Professor Abstract Electromigration is a reliability concern of microelectronic interconnections, especially for flip chip solder bump with high current density applied. This study shows that with the line-to-bump geometry in a flip chip solder joint, the current density changes significantly between the Al trace and the bump, while the current crowding...

Advances in theoretical ideas on how galaxies formed have not been strongly influenced by the advances in observations of what might be in the voids between the concentrations of ordinary optically selected galaxies. The theory and observations are maturing, and the search for a reconciliation offers a promising opportunity to improve our understanding of cosmic evolution. I comment on the deve...

 Variable Data Void Pantographs Steven J. Simske, Jason S. Aronoff, Margaret Sturgill

Transient simulation of refrigeration systems is a relevant tool in the development and optimization of household refrigerators. These models should be accurate but fast. The core of transient refrigeration system simulation is the heat exchanger model as it imposes the system pressures. Dynamic pressure variation inside the heat exchanger is governed by the apparent density and internal energy...

Using a nearest neighbor analysis, we construct a sample of void galaxies from the Sloan Digital Sky Survey (SDSS) and compare the photometric properties of these galaxies to the population of non-void (wall) galaxies. We trace the density field of galaxies using a volume-limited sample with zmax = 0.089. Galaxies from the flux-limited SDSS with z ≤ zmax and fewer than three volume-limited neig...

in various legal systems, with adoption of the validity of exclusion clause as a rule, in the exceptional instances for the reason of social importance of the matter and contrary to the public policy, exclusion clause is void. thus, in the case of death; bodily injuries; deliberated breach of contract or legal duty ;gross negligence and deception imputed to party relying to exclusion clause, it...

class Decorator { abstract void Draw();void Draw();

We studied electromigration (EM) lifetimes and void growth at low cumulative failure probability. We carried out EM test in damascene Cu lines using sudden-death type test structures. Its cumulative failure probability ranges from 0.005 to 90%. To investigate the void growth behaviour, Cu microstructures was investigated. EM lifetime shows correlation with the void nucleation site and the void ...

types are also available for the event-driven infrastructure and the parallel processing support. More information is provided in Section 5.2 and Section 6.1. Listing 3.2: C structs of DSPEElement and DSPEComponent. 1 struct DSPEElement { 2 DSPEElement *container; 3 DSPERunner *runner; 4 DSPEOwner *owner; 5 char* (*getID) (const DSPEElement *element); 6 }; 7 8 struct DSPEComponent { 9 DSPEEleme...

The effects of tight junction structure on water and solute fluxes across proximal tubular epithelium were examined with fiber-matrix equations previously derived by Curry and Michel (1980. Microvascular Research. 20:96-99). Using plausible estimates of tight junction fiber length and width the model predicts solute (Ps) and water permeability (Lp) coefficients that agree with the measured valu...