also known as the diffusion equation, describes in typical applications of the evolution in time of the density u u x, t of some quantities such as heat and chemical concentration 1, page 44 . In this case, the thermal diffusivity and thermal conductivity of the medium are assumed to be constant. However, in some media such as gases, the parameters are proportional to the temperature of the med...

Pureeing of sweetpotato (SP) is carried out to enhance the conversion of the roots into value-added products. During processing, production and home utilization, the puree is often heated (conventional cooking or microwaved), hence the need to measure the corresponding properties of SP puree. Thermal (specific heat, thermal conductivity, density, and thermal diffusivity) and dielectric properti...

• The dominant phase in the samples both before and after aging is FCC-Cu. Thermal diffusivity/conductivity non-sensitive to grain orientations. diffusivity decisive factor influencing thermal conductivity. Solid solute atoms significantly reduce diffusivity/conductivity. Aging treatment recovers property by precipitating solid solutes. effects of history on properties C-18150 (Cu-1.5Cr-0.5Zr, ...

The construction of mound-shaped nests by ants is considered as a behavioral adaptation to low environmental temperatures, i.e., colonies achieve higher and more stables temperatures than those of the environment. Besides the well-known nests of boreal Formica wood-ants, several species of South American leaf-cutting ants of the genus Acromyrmex construct thatched nests. Acromyrmex workers impo...

The problem of analyzing the impact anthropogenic carbon dioxide on environment necessitates study soil dynamics. Thermal parameters (heat capacity, thermal conductivity, and diffusivity) play an essential role in processes CO2 transfer production. Considering that these depend texture other various factors, mathematical description regime soils a specific area is relevant task. There are many ...

We analyzed the effect of strains on material transport in a typical dual damascene copper interconnect via under electromigration stress. The electromigration model incorporates all important driving forces for atom migration coupled with the solution of the electrical and thermal problems. Our approach differs from others by considering a diffusivity tensor in the transport equation taking in...