Many researchers have used different failure criteria in published solder joint reliability studies. Since the reported timeto-failure would be different if different failure criteria were used, it would be difficult to compare the reported reliability life of solder joints from one study to another. The purpose of this study is to evaluate the effect of failure criteria on the reported thermal...

Among various lead-free alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering technology. Moreover, to improve the characteristics of lead-free solders, the effect of the addition of minor elements to lead-free solders on the properties of solder and interfacial reactions have been studied. The purpose of this research was to in...

Temperature cycling tests are standard industry practice for determining the thermomechanical fatigue life of solder joints. Industry-standard temperature pro¢les usually start from room temperature, then go to a high temperature, then to a cold temperature, and then back to room temperature. In addition, most of the time, the temperature pro¢le contains dwell times at the highest and lowest te...

In order to protect the electronic components of electronic devices on a printed circuit board (PCB) against electromagnetic radiation, a conductive shield-can or box is normally attached to the PCB covering the electronic components. In particular, handheld electronic devices are prone to be subjected to drop impact. This means that the products would experience a significant amount of out-of-...

This guide recommends best practice used for short-term accelerated thermal cycling as a method for assessing solder joint reliability. Three techniques (shear testing, and electrical continuity measurements, complemented with microstructural investigations) are described. NPL Report CMMT(A)274 © Crown copyright 2000 Reproduced by permission of the Controller of HMSO

Effect of holding time and temperature on the fatigue life of micro Sn-Ag-Cu solder joint has been studied with waveform of triangle and trapezoid wave at 298K and 398K. Both the microstructural coarsening and the crack propagation occurred simultaneously and therefore the cyclic load decreased rapidly in the trapezoidal wave at 398K compared with the other conditions. Therefore, under the cond...