0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.08.017 ⇑ Corresponding author at: STMicroelectronics, 16 7155, 37071 Tours Cedex 2, France. Tel.: +33 (0)2 47 01 34. E-mail address: [email protected] (S. Jacqu In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the fo...

Workers in a modern electronics factory were surveyed by questionnaire and lung function testing to see if there was evidence of widespread work-related respiratory symptoms. Of the responding workers exposed to solder flux fumes on the shop floor, 22% had work-related breathlessness or wheeze or both. Exposed workers had a lower FEV1 and FVC than unexposed workers. Work-related rhinitis was al...

In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. Based on the dislocation controlled creep mechanism and Gibbs’ free-energy theory, a new creep constitutive model was proposed. The model was found to describe accurately the creep flow of the solder and to b...

Electromigration activation energy is measured by a built-in sensor that detects the real temperature during current stressing. Activation energy can be accurately determined by calibrating the temperature using the temperature coefficient of resistivity of an Al trace. The activation energies for eutectic SnAg and SnPb solder bumps are measured on Cu under-bump metallization (UBM) as 1.06 and ...

In this study, we used microstructure evolution and electron microprobe analysis (EPMA) to investigate the interfacial reactions in Sn-Zn and Sn-Zn-Al solder balls with Au/Ni surface finish ball-grid-array (BGA) bond pad over a period of isothermal aging at 150°C. During reflow, Au dissolved into the solder balls and reacted with Zn to form g-Au3Zn7 and g2-AuZn3. As aging progressed, g and g2 t...

In this study, a finite element study of design factors, including material constants and geometry parameters, affecting fatigue life of solder joints of a typical cavity-down Thermally Enhanced Ball Grid Array (TEBGA) assembly subjected to an accelerated temperature cycling load is performed. In order to precisely characterize the fatigue life of solder joints, the geometry profile of solder j...

Lead-free selective soldering can result in extended times at high temperatures, which in turn can result in excessive dissolution of exposed copper, such as plated through holes. This phenomenon is more severe with lead-free, since the alloys have higher melting points, hence requiring longer times for the PTH to reach the higher temperatures, and the alloys typically have a greater capacity t...

Surface finishes are used to preserve and promote solderability of exposed copper metallization on printed wiring boards. While in the best of worlds, the solder used in assembly should dictate the solder interconnect reliability, surface finishes are known to have an effect. The effect of surface finishes on solder interconnect reliability can be particularly strong under high strain rate load...

. Graduate Assistant, Ph.D candidate 2 . Corresponding Author, Professor, Dept. of Power Mechanical Engineering, National Tsing Hua University Abstract The flip chip packaging structure design and the fabrication process parameters will influence the packaging reliability and the performance of chip heat dissipation. The reliability of a flip chip package depends on the packaging structure desi...

Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and a PCB with dual in-line memory module (DIMM) sockets during solder reflow heating, while the finite elemen...