An approach recently introduced to correct the power factor of single-phase and three-phase diode rectifiers is extended to single-phase line-frequency phase-controlled rectifiers. First of all, the conventional circuit of the thyristor based rectifier is proposed to be modified in order to make possible the control of the DC-voltage mean value also in presence of a fully resistive behaviour of...

Electric fish evaluate the near environment by detecting changes in their self-generated electric organ discharge. To investigate impedance modulation of the self-generated electric field, this field was measured at the electrosensory fovea of Gymnotus carapo in the presence and absence of objects. Changes in local fields provoked by resistive objects were predicted by the change in total energ...

We study the nonlinear dynamics of series arrays of Josephson junctions in the large-N limit, where N is the number of junctions in the array. The junctions are assumed to be identical, overdamped, driven by a constant bias current, and globally coupled through a common load. Previous simulations of such arrays revealed that their dynamics are remarkably simple, hinting at the presence of some ...

This article describes the equilibrium shape of a liquid drop under applied fields such as gravity and electrical fields, taking into account material properties such as dielectric constants, resistivities, and surface tension coefficients. The analysis is based on an energy minimization framework. A rigorous and exact link is provided between the energy function corresponding to any given phys...

It is observed that the inductive and capacitive features of the memristor reflect (and are a quintessence of) such features of any resistor. The very presence of the voltage and current state variables, associated by their electrodynamics sense with electrical and magnetic fields, in the resistive characteristic v = f(i), forces any resister to accumulate some magnetic and electrostatic fields...

Three-dimensional (3D) integration is a fast emerging technology that offers integration of high density, fast performance and heterogeneous circuits in a small footprint. Through-Silicon-Vias (TSVs) enable 3D integration by providing fast performance and short interconnects among tiers. However, they are also susceptible to defects that occur during manufacturing steps and cause crucial reliab...

In this paper, an approach is proposed for extracting coupled RLC network from multi-level interconnects. The proposed approach starts with a step of partitioning the layout of the full-chip under consideration into several sublayouts, followed by steps of fracturing the partitioned layout and transforming into the three-dimensional structure. The layout is then classified into three species of...

We aim at constructing a common platform for compact model development based on the Verilog-A language for collaboration among different research groups. The project aims in particular at a framework for efficient development of multi-gate MOSFET models for circuit simulation. We have developed several prototypes of multi-gate MOSFET models based on different concepts till now. Phenomena expect...

A mathematical model is developed to calculate the impedance response of a semiconductor electrode to a sinusoidal current perturbation. The model accounts explicitly for electron and hole transport as well as generation and recombination through band-to-band mechanisms and through bulk interband electron acceptors of specified energy. The resistive (real) component of the impedance is shown to...

Simultaneous switching noise (SSN) has become an important issue in the design of the internal on-chip power distribution networks in current very large scale integration/ultra large scale integration (VLSI/ULSI) circuits. An inductive model is used to characterize the power supply rails when a transient current is generated by simultaneously switching the on-chip registers and logic gates in a...