A chiplet multi-objective optimization algorithm for 2.5-D integrated circuit (IC) based on a passive interposer is discussed in this article. Inspired by the network-on-chip mapping problem, we propose novel algorithm, called optimization, which minimizes average temperature and communication consumption between chiplets at same time. The considers specificities of IC chiplets, such as spacing...

For the 3D printing multi-objective optimization task scheduling problem, problem model is established from three aspects of related definition, constraint conditions, and objective function, which lays foundation for subsequent research solution.

This paper proposes a novel Self-Adaptive algorithm for Multi-Objective Constrained Optimization by using Radial Basis Function Approximations, SAMO-COBRA. The automatically determines the best Function-fit as surrogates objectives well constraints, to find new feasible Pareto-optimal solutions. also uses hyper-parameter tuning on fly improve its local search strategy. In every iteration one so...