This paper describes an application of pseudo-dynamic techniques to the dynamic analysis of piping structures. Essentially it consists in coupling a direct time integration algorithm, such as the Newmark method, to an experimental step. At each time step the integration algorithm generates a displacement vector of the structure, which is prescribed for the test specimen. This is mounted in a ri...

This publication presents lithography results for 3D wafer-level system integration applications using a reticle free maskless VPG+ 400 from Heidelberg Instruments. The focus is on high density Cu redistribution layer (RDL) formation with <2µm L/S used in polymer RDL stacks, overlay accuracy determination better than ±150nm and hybrid bond interconnect 2µm interconnects, all processed 300mm ...