We demonstrated soldering of an electrical component (the metal-oxide semiconductor field effect transistor (MOSFET)) on a printed circuit bord (PCB) via solder paste heated by microwave irradiation. The behavior the object soldered with in magnetic and electric were evaluated using various resonators. In field, was selectively confirmed that MOSFET connected onto PCB without any damage operate...

In this paper, we compare a new 1.2 kV rated 4H-SiC split-gate (SG) MOSFET with the conventional planar-gate (PG) MOSFETs. Both structures were fabricated same design rules and process platform. Therefore, have similar electrical parameters, such as ON-state drain-source resistance (RON), breakdown voltage (BV), threshold (Vth), body diode forward (VSD). It is shown that Ciss/Coss/Crss capacita...

The accuracy of a MOSFET dosimetry system with respect to peripheral therapeutic doses from high-energy X-rays has been evaluated. The results have been compared with ionisation chamber measurements in the same peripheral regions of the beam. For 6 MV and 18 MV X-ray beams, the MOSFET system in the high-sensitivity mode produces reproducibility of dose measurement with relative standard deviati...

Silicon VDMOS power MOSFET technology is being supplanted by UMOS (or trench) power MOSFET technology. Designers of spaceborne power electronics systems incorporating this newer power MOSFET technology need to be aware of several unique threats that this technology may encounter in space. Space radiation threats to UMOS power devices include vulnerabilities to SEB, SEGR, and microdose. There ha...

The split-C(V) technique has served during three decades for independent extraction of the inversion and accumulation charge in MOSFETs from the direct measurement of the gate-to-channel capacitance [1]. The total charge, Q, obtained from the integration of the gateto-channel capacitance curves, can be used for the evaluation of the carrier mobility using the standard MOSFET equations (μ α ID/Q...

The key to successfully applying the SiC MOSFET requires an understanding of the device’s unique operating characteristics. In this section, the characteristics of Cree’s 1200V 80mΩ SiC MOSFET (CMF20120D) will be discussed. Comparisons will be made with other similar silicon devices along with application implications. The intention of this comparison is to illustrate the differences in operati...

A correlation between the gated-diode R-G current and the performance degradation of SOI n-channel MOS transistor after F-N stress test has been demonstrated in this paper. Due to increase of interface traps after F-N stress test, the generation-recombination (R-G) current of the gateddiode in the SOI-MOSFET architecture increases while the performance characteristics of MOSFET transistor such ...

The device design of future nanoscale MOSFETs is reviewed. Major challenges in the design of the nanometer MOSFETs and the possible solutions are discussed. In this paper, special emphasis is placed on the combination of new transistor structures that suppress the short channel effect and on back-gate voltage control that suppresses the characteristics variations. Two new device architectures, ...