نتایج جستجو برای: molded part dimensions

تعداد نتایج: 789695  

2004
Michael Gaitan Laurie E. Locascio

This paper describes the first demonstration of temperature control and flow sensing of fluids using integrated circuit (IC)-based microheating elements embedded in microchannels molded in polydimethylsiloxane (PDMS). Fluid channels and connections to capillary tubing are molded in PDMS using a silicon wafer template. The PDMS film is then bonded to an IC that contains the micromachined microhe...

Journal: :Journal of the Japan Society of Powder and Powder Metallurgy 1987

Journal: :Periodica Polytechnica Mechanical Engineering 2018

Journal: :Journal of the Japan Society of Powder and Powder Metallurgy 2002

2016
Daniel J. Magagnosc Wen Chen Golden Kumar Jan Schroers Daniel S. Gianola

Metallic glasses are disordered materials that offer the unique ability to perform thermoplastic forming operations at low thermal budget while preserving excellent mechanical properties such as high strength, large elastic strain limits, and wear resistance owing to the metallic nature of bonding and lack of internal defects. Interest in molding micro- and nanoscale metallic glass objects is d...

Journal: :Optics letters 2004
Andrea L Martin Deniz K Armani Lan Yang Kerry J Vahala

Ultrahigh-Q microtoroids on a chip are applied as replication masters to demonstrate replica-molded high-Q microresonator arrays. Replica Q factors are nearly material loss limited, affirming the integrity of the replication process, and are as high as 5 x 10(6), or nearly a factor of 40 greater than previous polymer-based devices. Because the molding process is nondestructive, both the master ...

Journal: :IOP Conference Series: Materials Science and Engineering 2020

Journal: :Microelectronics Reliability 2008
Masaaki Koganemaru Toru Ikeda Noriyuki Miyazaki

The high residual stress in a resin-molded electronic package sometimes makes the electronic functions unstable. Therefore the residual stress in electronic packages, especially on the top surfaces of semiconductor chips, should be evaluated. The objective of this study is to present a simple method for evaluating residual stress in resin-molded semiconductor chips using a combination of experi...

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