This article describes an approach for implementing a complete computer system ~CPU, RAM, I/O, and nonvolatile mass memory! on a single integrated-circuit substrate ~a chip!—hence, the name ‘‘single-chip computer.’’ The approach presented combines advances in the field of microelectromechanical systems ~MEMS! and micromagnetics with traditional low-cost very-large-scale integrated circuit style...

Microelectromechanical systems (MEMS) are used in different applications such as automotive, biomedical, aerospace and communication technologies. They create new functionalities and contribute to miniaturize the systems and reduce their costs. However, the reliability of MEMS is one of their major concerns. They suffer from different failure mechanisms which impact their performance, reduce th...

Study of contact and friction at multiple length scales is necessary for the effective design and analysis of surfaces in sliding microand nano-electromechanical systems (MEMS/NEMS). As loading forces decrease in such applications, the size of the asperity contacts tends to decrease into the nano scale regime. Also with the increase in surface area to volume ratio in such systems, the surface f...

INTRODUCTION Qconv SUGAR is a simulation package for 3D MEMS devices that utilizes nodal analysis techniques [1]. It has been shown that nodal analysis is significantly faster than other simulation techniques and can be just as accurate. The latest version of SUGAR (v2.0) includes various models for 2D and 3D beams, electrical beams, and gap closing actuators [2]. In addition, SUGAR is easily e...

Static friction in shearing mode can be expressed as the product of the shear strength of the interface and the real contact area. The influence of roughness on friction in elastic adhesive contact is analyzed. Special attention is paid to low loading conditions, in which the number of contact points is small. The models are used to analyze a friction experiment in a MEMS friction meter.

For the lack of formula of linear range for S-shaped MEMS planar micro-spring, this paper establishes physical and mathematical model and analysis the material stress-strain angle. The formula is deduced by calculating the strain and rotation of the basic unit of micro-spring tension. Compared with the results of the tests on micro-spring which produced by UV-LIGA process, the formula results i...

The paper demonstrates reduced order modeling (ROM) of the strongly coupled system level dynamic analysis of micro electro mechanical systems (MEMS) by lumped finite elements (FE) and substructuring implemented in the ANSYS/Multiphysics program. Index terms Micro Electromechanical Systems (MEMS), Finite elements (FE), Coupled analysis, Reduced order modeling (ROM)

This paper presents an original multi-sensor system for 3D orientation determination based on only 4 MEMS sensors. The complete system has been prototyped proving the feasibility of such device.