ABSTRACT A novel hydrogen activation technology based on activated or electron attachment (EA) has been developed for fluxless soldering at ambient pressure and normal temperature. The the potential to be used several applications in electronics packaging industry. Recent work from a joint effort between Air Products Sikama International alpha trials of production-scale furnace flux-free wafer ...

LEGO-style cut-and-choose is known for its asymptotic efficiency in realizing actively-secure computations. The dominant cost of LEGO protocols is due to wire-soldering — the key technique enabling to put independently generated garbled gates together in a bucket to realize a logical gate. Existing wire-soldering constructions rely on homomorphic commitments and their security requires the majo...

LEGO-style cut-and-choose is known for its asymptotic efficiency in realizing actively-secure computations. The dominant cost of LEGO protocols is due to wire-soldering — the key technique enabling to put independently generated garbled gates together in a bucket to realize a logical gate. Existing wire-soldering constructions rely on homomorphic commitments and their security requires the majo...