Tin whisker growth is a serious reliability concern for electronics using high-density packaging. Whisker growth behavior of tin lead eutectic solders doped with different neodymium concentration (5–0.1wt.%) was studied in present work. Results indicate that the Nd in the all of the Sn–Pb–Nd alloys mainly exists in NdSn3 intermetallic compound, and that the distribution of the NdSn3 phase is ve...

The newly found ternary compound NdNiMg5 has been studied within DFT based methodologies. Results of cohesive energy, charge transfers, elastic constants and electron localized function mapping as well as electronic structure and bonding properties have been compared with those of isostructural binary NdNi. The calculation results have shown that Mg substructures interlayering NdNi–like slabs e...

We demonstrate the peculiarities of magnetization process in ferrimagnetic intermetallic compound (Nd0.5Dy0.5)2Fe14B, which has been studied theoretically and experimentally using ultrahigh magnetic fields. observe phase transition induced by external fields (up to 170 T) also describe analytically terms critical In this work, first second field-induced transitions, Hc1 Hc2, were estimated, res...

Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn–Ag–Cu solder powder and the interfacial morphology of the solder and flexible BGA substrates were characterized metallographically. At their interfaces, different types of scallop-shaped intermetallic compound layers such as ...

Abstract—Joining of 1mm thick aluminum 6061 to titanium TC4 was conducted using Bypass-current MIG welding-brazed, and stable welding process and good bead appearance were obtained. The Joint profile and microstructure of Ti/Al joints were observed by optical microscopy and SEM and then the structure of the interfacial reaction layers were analyzed in details. It was found that the intermetalli...

We present magnetic characterization of a binary rare-earth intermetallic compound Er(5)Si(3), crystallizing in Mn(5)Si(3)-type hexagonal structure, through magnetization, heat capacity, electrical resistivity and magnetoresistance measurements. Our investigations confirm that the compound exhibits two magnetic transitions with decreasing temperature, the first one at 35 K and the second one at...

The use of Fe-Al intermetallic compound coatings has been investigated in order to improve the tribological behaviour of carbon tool steel. The coatings were formed by a pack cementation process and subsequently diffusion annealing at 900˚C in an argon controlled atmosphere. The optimum diffusion time was selected on the basis of optimum thickness and tribological behaviour. The microstructure...

Phase transitions in the Co-rich part of Co–Al–Nb–Mo phase diagram are studied by energy dispersive spectroscopy (EDS), X-ray analysis, transmission electron microscopy (TEM), and differential scanning calorimetry (DSC) measurements. The obtained results were compared with for alloys binary Co–Al ternary Co–Al–Nb, Co–Al–Mo systems. Formation intermetallic L12 structure was found a range 10 at.%...