نتایج جستجو برای: dynamic mechanical thermal analysis

تعداد نتایج: 3480840  

2013
Charles Wan Kenneth L. Marshall

Adhesive strength is of critical importance for cryogenic laser-fusion targets when bonding the plasma-polymerized polystyrene copolymer plastic target shell to the support stalk (a narrow-diameter fiber of silicon carbide or Zylon PBO). Norland 68 and Dymax 921 gel, two rapid-curing, low-to-medium viscosity UV curable adhesives, are currently used for target fabrication depending on which fibe...

Javad Jafari Fesharaki, Sa’id Golabi Seyed Ghasem Madani

This research develops thermo-elastic analysis of a functionally graded cylinder under thermo-mechanical loadings. Heat conduction equation in cylindrical coordinate system is solved. Thermal conductivity coefficient is graded along the radial direction. By considering a symmetric distribution of temperature, loading and boundary conditions, strain-displacement and stress-strain relations can b...

ژورنال: Journal of Railway Research 2021
GEBRE, ABRHAM , KASSA, ELIAS, NTAKIYEMUNGU , MATHIEU,

There are several factors causing fastening systems to deteriorate faster than the designed life. The high repetitive loads from a moving train being one of the main factors, track irregularities, design and installation defects of track components, non-uniform rail support stiffness, unevenness in the rail seat deterioration are some of the factors causing fastenings systems to deteriorate fas...

AR. Davoodinik , GH. Rahimi ,

The intention of this study is the analysis of thermal behavior of functionally graded beam (FGB). The distribution of material properties is imitated exponential function. For thermal loading the steady state of heat conduction with exponentially and hyperbolic variations through the thickness of FGB, is considered. With comparing of thermal behavior of both isotropic beam and FGB, it is appea...

A series of high-density polyethylene/Cloisite 20A/graphite nanocomposites were prepared via melt blending for the production of polymeric pipes for natural gas transfer. The microstructural, mechanical, thermal, electrical and barrier properties of prepared nanocomposites were investigated. An intercalated morphology was observed for prepared nanocomposites. Improved mechanical properties ...

2008
Soon-Bok Lee Ilho Kim

Modern electronics products move in the direction of complex, high density, high speed and also thinner and lighter for portability. Reliability of interconnection of electronics packaging has become critical issue. Major functions of electronic packaging are briefly discussed and failure mechanisms of electronic packaging are explained. Electronics packaging is subjected to mechanical vibratio...

2005
M. Makrocka-Rydzyk S. Jurga

Nuclear magnetic resonance, broadband dielectric spectroscopy and dynamic-mechanical thermal analysis were employed to study molecular dynamics of ethylene-norbornene copolymer. The analysis of experimental data indicates existence of three motional processes denoted as α, β, and γ in order of decreasing temperature. The α relaxation is related to the dynamic glass transition, while the β relax...

A. Ghorbanpour Arani, A. Haghshenas M. Azami S. Amir Z. Khoddami Maraghi

Electro-thermo-elastic stress analysis of piezoelectric polymeric thick-walled cylinder reinforced by boronnitride nanotubes (BNNTs) subjected to electro-thermo-mechanical fields is presented in this article. The electro-thermo-elastic properties of piezoelectric fiber reinforced composite (PEFRC) was studied by a modified XY micromechanical model capable of exhibiting full coupling relati...

ژورنال: کومش 2021

Introduction: There are various animal models to investigate neuropathic pain which the most usual one is chronic constriction injury method. The aim of the present study was the evaluation of neuropathic pain following chronic spiral suturing around the sciatic nerve without ligation as a new model. Materials and Methods: Thirty Wistar male rats, weighting 180-220 gram randomly were divided in...

2006
Jedrzej Banaszczyk Gilbert De Mey Marcin Janicki Andrzej Napieralski Bjorn Vermeersch Piotr Kawka

This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the Nyquist plot of the thermal impedance. The experiments carried out demonstrate...

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