نتایج جستجو برای: drop weight setup

تعداد نتایج: 425765  

Journal: :International Journal of Impact Engineering 2021

Impact force and structural response of reinforced concrete (RC) beams under drop weight impact have been intensively studied reported in the literature. The prediction peak has well investigated while study overall profile governing is limited. parameters acting on a structure including force, plateau duration all affect responses. This investigates profiles from RC beams. effects global stiff...

Journal: :Buildings 2023

In this article, a partial selection of experiments on enhancing the impact resistance structural components with non-metallic, textile-reinforced concrete is discussed. The focus experimental investigations in which thin, plates characterized. article discusses materials, fabrics and test setup used. For work, drop tower from Otto Mohr Laboratory, belongs to Technische Universtät Dresden, was ...

Journal: :The journal of physical chemistry. B 2007
Simone Wiegand Hui Ning Hartmut Kriegs

We developed a thermal diffusion forced Rayleigh scattering (TDFRS) setup operating at a writing wavelength of 980 nm, which corresponds to an absorption band of water with an absorption coefficient of approximately 0.5 cm(-1). Therefore, aqueous mixtures require no dye to convert the light into heat energy. Especially for aqueous system with a complex phase behavior such as surfactant systems,...

Journal: :European Journal of Operational Research 2009
S. Michel N. Perrot François Vanderbeck

RÉSUMÉ : We consider two variants of knapsack problems with setups arising as subproblems in a DantzigWolfe decomposition approach to more complex combinatorial optimization problems. In the multiple-class binary knapsack problem with setups, items are partitioned into classes whose use implies a setup cost and associated capacity consumption. Item weights are assumed to be a multiple of their ...

Journal: :Microelectronics Reliability 2006
Desmond Y. R. Chong F. X. Che John H. L. Pang Kellin Ng Jane Y. N. Tan Patrick T. H. Low

Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization process is critical to the lead-free (Pb-free) solders that are replacing lead-based (Pb-based) solders. In this study, drop impact solder joint reliability for plastic ball grid array (PBGA), very-thin quad flat no-l...

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