نتایج جستجو برای: dielectric materials

تعداد نتایج: 469872  

2016
M. K. Maurya

In the present paper, photoconductive and dielectric dependence oscillation characteristics of a single photorefractive ring resonator have been studied for the case of non-degenerate two-wave mixing in photorefractive materials by employing the plane-wave approximation method. The influence of photoconductivity and dielectric constant of photorefractive materials on frequency of oscillation an...

2011
S. Suresh A. Ramanand D. Jayaraman S. M. Priya R. Vasanthakumari

The strong electro mechanical coupling exhibited by the ferroelectric materials is the remarkable feature of these materials. Therefore, they find applications in sensors, actuators for producing ultrasonics and micro positioning. The material dichloridoglycine zinc dihydrate is a centrosymmetric ferroelectric crystal. In the present study, this crystal has been grown from a mixture of glycine ...

2004
Samir Trabelsi Stuart O. Nelson Richard B. Russell

INTRODUCTION Electromagnetic wave interaction with materials containing water at microwave frequencies is dominated by water [1]. Water is an important component of many biological and nonbiological materials. It is sometime divided into two categories: free water and bound water. From an electrical standpoint, behavior of free water is well described by the Debye dielectric model [1] with a si...

Journal: :Remote Sensing 2014
Francesca De Chiara Simona Fontul Eduardo Fortunato

In railways Ground Penetrating Radar (GPR) studies, the evaluation of materials dielectric properties is critical as they are sensitive to water content, to petrographic type of aggregates and to fouling condition of the ballast. Under the load traffic, maintenance actions and climatic effects, ballast condition change due to aggregate breakdown and to subgrade soils pumping, mainly on existing...

2005
R. S. Brusa C. Macchi S. Mariazzi

Until the past few years, aluminium was used in semiconductor technology as interconnect metal and silicon dioxide (SiO2, κ = 3.9) as the interand intra-level insulator. With the demand of scaling the dimension of advanced integrated circuits well below the 100 nm DRAM 1/2 pitch technology node [1], the signal delay (resistance–capacitance RC delay) becomes one limitation in increasing the spee...

2009
Kausik Bal V K Kothari

Dielectric properties of textile materials have been used in process and quality control in relation to the moisture content, unevenness, drying, static generation, etc. Although dielectric properties of fibres and fibrous assemblies have been the subject of study of many researchers for a long time, the understanding of the subject, however, is still incomplete. With the advent of new characte...

2014
Sweta Sharma Md Soaib Khan Rajiv Ranjan R. N. P. Choudhary

Polycrystalline samples of Gd-modified Lead Zirconate Titanate [PGZT; Pb1-xGdx(Zr0.65Ti0.35)1-x/4O3] ceramics (where, x = 0.00, 0.06 and 0.09) were prepared using high temperature mixed oxide method at sintering temperature 1450 K. Preliminary structural analysis through X-ray diffraction technique suggests their formation in single phase tetragonal crystal system at room temperature. From the ...

2012
Terence K.S. Wong

The time dependent dielectric breakdown phenomenon in copper low-k damascene interconnects for ultra large-scale integration is reviewed. The loss of insulation between neighboring interconnects represents an emerging back end-of-the-line reliability issue that is not fully understood. After describing the main dielectric leakage mechanisms in low-k materials (Poole-Frenkel and Schottky emissio...

2015
G. Gramse M. A. Edwards L. Fumagalli G. Gomila

We present the implementation of dynamic electrostatic force microscopy in liquid media. This implementation enables the quantitative imaging of local dielectric properties of materials in electrolyte solutions with nanoscale spatial resolution. Local imaging capabilities are obtained by probing the frequency-dependent and ionic concentration-dependent electrostatic forces at high frequency (>1...

2007
Carlos Gonzales Sean Foley

Copper and low dielctric constantant (k) materials are poised to become the dominant interconnect scheme for integrated circuits for the future because of the low resistance and capacitance that they offer which can improve circuit performance by more than 30 % over conventional interconnect schemes. This paper addresses the thermomechanical stresses in the CuILow k interconnect scheme through ...

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