This paper presents a warpage analysis method that predicts the warpage behavior of electroplated Cu films on glass fiber-reinforced polymer (GFRP) packaging substrates. The analysis method is performed using the following sequence: fabricate specimens for scanning 3D contours, transform 3D data into curvatures, compute the built-in stress of the film using a stress-curvature analytic model, an...

1 Abstract The warpage characterizations of injection molded plastic parts are not standardized and very challenging due to its complex process. This paper presents a novel examination method of the deformation of injection molded plastic parts especially for fiber reinforced materials. A special, but simple part was introduced for the description of the effect of different technological parame...

Coreless substrate is excellent for fine patterning, small via pitches, and transmission property, and it is a promising IC packaging method for the next generation. Warpage of coreless substrate is generally large compared to the other types of IC packaging substrates because of inadequate rigidity, so the most important problem for the application of coreless substrates for high-end BGAs is w...

A model has been developed to predict the yield of solder flip-chip assemblies. Yield was found in relation to the mean and the standard deviation of the solder volume distribution, the assembly warpage, and the chip size. In this study, solder volume was represented by the diameters of the solder balls. The model identified failed joints using the Surface Evolver and a regression model. The re...

injection molding is the most widely used process for producing plastic parts.in this process, an important issue is to predict and optimize the warpage before manufacturing. in this paper, a simulation with moldflow software is proposed to optimize the injection molding process. the optimization process aims at minimizing the warpage of the critical injection molding part in which process para...

In this study, an adaptive optimization method based on artificial neural network model is proposed to optimize the injection molding process. The optimization process aims at minimizing the warpage of the injection molding parts in which process parameters are design variables. Moldflow Plastic Insight software is used to analyze the warpage of the injection molding parts. The mold temperature...

In semiconductor packaging, warpage is one of the critical issues during molding stage. It is related to a thermal mismatch i.e. coefficient of thermal expansion (CTE) values and reliability of passive components in the package. Finite element method (FEM) is able to perform extensive structural analysis of quad flat no-lead (QFN) package designs once verified by experiments. 2 factorial is emp...

This paper deals with the development of accurate warpage prediction model for plastic injection molded parts using soft computing tools namely, artificial neural networks and support vector machines. For training, validating and testing of the warpage model, a number of MoldFlow (FE) analyses have been carried out using Taguchi’s orthogonal array in the design of experimental technique by cons...

Warpage is one of the most challenging defects occurring in plastic injection moulded parts. Various approaches to overcome this issue have been proposed literature, but they all provide only partial solutions problem. This paper proposes a new method for compensation and minimisation warpage. The based on Mould Cavity (MC) correction. In contrast other similar methods, here MC correction accom...

Injection molding is classified as one of the most flexible and economical manufacturing processes with high volume of plastic molded parts. Causes of variations in the process are related to the vast number of factors acting during a regular production run, which directly impacts the quality of final products. A common quality trouble in finished products is the presence of warpage. Thus, this...