Continuous scaling of transistor geometries increases leakage current exponentially. This makes differentiating faulty and fault-free chips extremely difficult. The concept of wafer signature is proposed. A wafer signature is obtained by sorting all IDDQ readings on a wafer for a vector. A break or jump in the wafer signature is considered to indicate defective chips. The use of wafer signature...

Two types of micron-diamond films were prepared on YG6 substrate by hot filament chemical vapor deposition(HFCVD) method. Morphology and orientation of crystalline growth were evaluated by SEM and XRD. Diamond film coated tools and sapphire wafer’ surface before and after lapping experiment  were contrasted. The results indicated that a significant change in Raman spectrum of two types of micro...

Applied pressure in chemical mechanical polishing CMP is shared by the two-body pad–wafer and the three-body pad–abrasive– wafer contacts. The fraction of applied pressure transferred through the particle contacts is a significant factor as most of the material removal is due to abrasive particles trapped in the pad–wafer interface. In this work, the contact of a rough, deformable pad and a smo...

Introduction The semiconductor industry is now facing a major turning point in how to realize the next generation of large-scale integration. Recently 3D integration (3DI) using through-silicon via (TSV) has widely studied and wafer thinning has been considered to be a promising technology for enhancing system performance instead of conventional two-dimensional (2D) scaling due to technical and...

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...

Axiomatic Design was used to develop a complete platform for chemical mechanical polishing (CMP) of silicon wafers. A functional requirement of the machine emerging from the axiomatic design process is the control of the wafer-scale polishing uniformity. Mechanisms to maintain control of the uniformity were designed, and integrated into a wafer carrier, which holds the wafer during polishing an...

The cost-effectiveness of market-dominating silicon wafer solar cells plays a key role in determining the competiveness of solar energy with other exhaustible energy sources. Reducing the silicon wafer thickness at a minimized efficiency loss represents a mainstream trend in increasing the cost-effectiveness of wafer-based solar cells. In this paper we demonstrate that, using the advanced light...

The increasing demand for more functions and features coming along with cost reduction plays a significant role in today’s product design and manufacturing technologies of mobile devices such as PDAs, laptop computer and mobile phones. Besides the main function of the device, imaging is considered as core feature by the user and major mobile phone manufacturers. Therefore the industry puts a lo...