Through-silicon via (TSV) is a key component for the vertical interconnection of a 3D IC which can provide a significant performance improvement with greatly reduced physical length of channels among vertically integrated chips. TSV technology is used both in three-dimensional stacked ICs (3D-SICs), as well as in so-called 2.5D-SICs and supports high performance, small footprint and lower power...

In this paper, closed-form expression for the parasitic capacitance of tapered TSV (T-TSV) considering metal–oxide–semiconductor (MOS) effect is proposed by solving two-dimensional (2D) Poisson's equation. ANSYS Q3D Extractor is employed to verify the proposed model for the slope wall angle of 751, 801, 851 and 901. It is shown that error is less than 5%. The capacitance characterization of cop...

Continuous scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently threedimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Thermo-mechanical reliability is a key concern for the development of TSV...

Pacific white shrimp Penaeus vannamei that were pre-exposed to Taura syndrome virus (TSV) and then challenged with yellow head virus (YHV) acquired partial protection from yellow head disease (YHD). Experimental infections were carried out using specific-pathogen-free (SPF) shrimp which were first exposed per os to TSV; at 27, 37 and 47 d post infection they were then challenged by injection wi...

In this study, analytical model and electrical equivalent circuit of Through Silicon Via (TSV) is analyzed. Through silicon Vias form an integral component of the 3-D IC technology by enabling vertical interconnections in 3-D ICs. Among various types, the performances of the simplified lumped TSV model of cylindrical and co-axial type were studied. The performance analyses of these structures w...

An unusual and distinguishing feature of alfalfa mosaic virus (AMV) and ilarviruses such as tobacco streak virus (TSV) is that the viral coat protein is required to activate the early stages of viral RNA replication, a phenomenon known as genome activation. AMV-TSV coat protein homology is limited; however, they are functionally interchangeable in activating virus replication. For example, TSV ...

BACKGROUND AND PURPOSE Thalamostriate vein (TSV) is an important tributary of the internal cerebral vein, which mainly drains the basal ganglia and deep medulla. The purpose of this study was to explore the anatomic variation and quality of TSV and its smaller tributaries using susceptibility-weighted imaging (SWI). METHODS We acquired SWI images in 40 volunteers on a 3.0T MR system using an ...

The present study was a protocol for investigation of the effect of acetaminophen (i.p.) on pain induced by electrical stimulation. We used tail shock vocalization (TSV) test for measurement of the pain. In this test, the animals were restrained and stimulated by two electrode implanted on the middle of the animal’s tail. The latency from stimulation of the tail till vocalization of the animal ...

The present study was a protocol for investigation of the effect of acetaminophen (i.p.) on pain induced by electrical stimulation. We used tail shock vocalization (TSV) test for measurement of the pain. In this test, the animals were restrained and stimulated by two electrode implanted on the middle of the animal’s tail. The latency from stimulation of the tail till vocalization of the animal ...