An investigation on the solder bumped Flip Chip on Printed Circuit Board (FCOB) is presented in this paper. The emphasis is placed on the effects of delamination crack between the underfill encapsulant and the solder mask on the solder joint reliability of FCOB. In the present study, a fracture mechanics approach is employed. The strain energy release rate at the crack tip between the underfill...

In this review the quenching of the weak axial-vector coupling strength, gA, is discussed in nuclear β and double-β decays. On one hand, the nuclear-medium and nuclear many-body effects are separated, and on the other hand the quenching is discussed from the points of view of different many-body methods and different β-decay and double-β-decay processes. Both the historical background and the p...

When the Seiberg-Witten curve of a four-dimensional N = 2 supersymmetric gauge theory wraps a Riemann surface as a multi-sheeted cover, a topological constraint requires that in general the curve should develop ramification points. We show that, while some of the branch points of the covering map can be identified with the punctures that appear in the work of Gaiotto, the ramification points gi...

this paper is concerned with the problem of synchronization for complex dynamic networks with state and coupling time-delays. therefore, larger class and more complicated complex dynamic networks can be considered for the synchronization problem. based on the lyapunov-krasovskii functional, a delay-independent criterion is obtained and formulated in the form of linear matrix inequalities (lmis)...